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Jeffery C. C. LoHKUST Foshan Research Institute for Smart ManufacturingVerified email at ust.hk
Fubin SongAmazonVerified email at amazon.com
Keith NewmanAMDVerified email at amd.com
Xing QIUHong Kong University of Science and TechnologyVerified email at connect.ust.hk
Qiming ZhangExponentVerified email at ust.hk
Jingshen WuHong Kong University of Science and TechnologyVerified email at ust.hk
Xiaowu Zhanginstitute of microelectronicsVerified email at ime.a-star.edu.sg
Fred LeNexperia (former SPBU of NXP)Verified email at connect.ust.hk
Xuejun FanProfessor of Lamar UniversityVerified email at lamar.edu
T.X. YuProfessor Emeritus, Department of Mechanical and Aerospace Engineering, Hong Kong University ofVerified email at ust.hk
Rong SunShenzhen Institutes of Advanced Technology, Chinese Academy of SciencesVerified email at siat.ac.cn
Michael G. PechtUniversity of MarylandVerified email at umd.edu
Dongkai ShangguanVerified email at ieee.org
Haibin CHENHong Kong University of Science and Technology (Guangzhou)Verified email at hkust-gz.edu.cn
Michael OstermanCALCE, University of MarylandVerified email at umd.edu
Carl HerakovichProfessor emeritus Univeristy of VirginiaVerified email at virginia.edu
Meiling ZhuProfessor of Machinical Engineering, University of ExeterVerified email at exeter.ac.uk