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Jie-Hua Zhao
Jie-Hua Zhao
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Title
Cited by
Cited by
Year
Low dielectric constant materials for ULSI interconnects
M Morgen, ET Ryan, JH Zhao, C Hu, T Cho, PS Ho
Annual Review of Materials Science 30 (1), 645-680, 2000
5092000
Circuit device with at least partial packaging and method for forming
GR Leal, JH Zhao, ER Prack, RJ Wenzel, BD Sawyer, DG Wontor, ...
US Patent 6,838,776, 2005
2472005
Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
GR Leal, JH Zhao, ER Prack, RJ Wenzel, BD Sawyer, DG Wontor, ...
US Patent 6,921,975, 2005
2312005
Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films
JH Zhao, T Ryan, PS Ho, AJ McKerrow, WY Shih
Journal of Applied Physics 85 (9), 6421-6424, 1999
1721999
Packaging effects on reliability of Cu/low-k interconnects
G Wang, C Merrill, JH Zhao, SK Groothuis, PS Ho
IEEE Transactions on Device and Materials Reliability 3 (4), 119-128, 2003
1552003
Simultaneous measurement of Young’s modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates
JH Zhao, Y Du, M Morgen, PS Ho
Journal of Applied Physics 87 (3), 1575-1577, 2000
982000
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds
MD Placette, X Fan, JH Zhao, D Edwards
Microelectronics Reliability 52 (7), 1401-1408, 2012
922012
Reliability issues for flip-chip packages
PS Ho, G Wang, M Ding, JH Zhao, X Dai
Microelectronics Reliability 44 (5), 719-737, 2004
922004
Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane
JH Zhao, I Malik, T Ryan, ET Ogawa, PS Ho, WY Shih, AJ McKerrow, ...
Applied Physics Letters 74 (7), 944-946, 1999
841999
Characterization of viscoelasticity of molding compounds in time domain
SH Chae, JH Zhao, DR Edwards, PS Ho
International Electronic Packaging Technical Conference and Exhibition 43598 …, 2009
822009
Thermal stress and glass transition of ultrathin polystyrene films
JH Zhao, M Kiene, C Hu, PS Ho
Applied Physics Letters 77 (18), 2843-2845, 2000
712000
D− centers in spherical quantum dots
JL Zhu, JH Zhao, WH Duan, BL Gu
Physical Review B 46 (12), 7546, 1992
671992
Experimental evaluations of the strength of silicon die by 3-point-bend versus ball-on-ring tests
JH Zhao, J Tellkamp, V Gupta, DR Edwards
IEEE Transactions on electronics packaging manufacturing 32 (4), 248-255, 2009
662009
Experimental evaluations of the strength of silicon die by 3-point-bend versus ball-on-ring tests
JH Zhao, J Tellkamp, V Gupta, D Edwards
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM …, 2008
662008
Microstructure-based stress modeling of tin whisker growth
JH Zhao, P Su, M Ding, S Chopin, PS Ho
IEEE transactions on electronics packaging manufacturing 29 (4), 265-273, 2006
642006
Circuit device with at least partial packaging and method for forming
GR Leal, JH Zhao, ER Prack, RJ Wenzel, BD Sawyer, DG Wontor, ...
US Patent 7,361,987, 2008
632008
Analysis and modeling verification for thermal-mechanical deformation in flip-chip packages
JH Zhao, X Dai, PS Ho
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998
631998
Neutral and negative donors in quantum dots
JL Zhu, JH Zhao, JJ Xiong
Journal of Physics: Condensed Matter 6 (27), 5097, 1994
571994
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures
JH Zhao, WJ Qi, PS Ho
Microelectronics Reliability 42 (1), 27-34, 2002
542002
Dimensionality and potential-shape effects on D 0 and D− ground states in quantum dots
JL Zhu, JH Zhao, JJ Xiong
Physical Review B 50 (3), 1832, 1994
531994
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