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Uwe Paul Schroeder
Uwe Paul Schroeder
Other namesU. P. Schroeder
Globalfoundries
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Cited by
Cited by
Year
Ferroelectricity in HfO2 enables nonvolatile data storage in 28 nm HKMG
J Müller, E Yurchuk, T Schlösser, J Paul, R Hoffmann, S Müller, D Martin, ...
2012 symposium on VLSI technology (VLSIT), 25-26, 2012
2962012
Influence of the cross-linker reactivity on the formation of inhomogeneities in hydrogels
B Lindemann, UP Schröder, W Oppermann
Macromolecules 30 (14), 4073-4077, 1997
951997
A 0.13/spl mu/m CMOS platform with Cu/low-k interconnects for system on chip applications
T Schiml, S Biesemans, G Brase, L Burrell, A Cowley, KC Chen, ...
2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No …, 2001
842001
Properties of polyelectrolyte gels
UP Schröder, W Oppermann
Physical properties of polymeric gels, 19-38, 1996
601996
A modular 0.13/spl mu/m bulk CMOS technology for high performance and low power applications
LK Han, S Biesemans, J Heidenreich, K Houlihan, C Lin, V McGahay, ...
2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No …, 2000
372000
Nanosecond laser anneal (NLA) for Si-implanted HfO2 ferroelectric memories integrated in back-end of line (BEOL)
L Grenouillet, T Francois, J Coignus, S Kerdiles, N Vaxelaire, ...
2020 IEEE Symposium on VLSI Technology, 1-2, 2020
342020
Physical Properties of Polymeric Gels
UP Schröder, W Oppermann, CA JP
John Wiley and Sons, Ch. Properties of Polyelectrolyte Gels, 19-38, 1996
321996
Polymer-stabilized reflective cholesteric displays: effects of chiral polymer networks on reflectance properties
DJ Dyer, UP Schröder, KP Chan, RJ Twieg
Chemistry of materials 9 (7), 1665-1669, 1997
311997
Innovations in special constructs for standard cell libraries in sub 28nm technologies
M Rashed, N Jain, J Kim, M Tarabbia, I Rahim, S Ahmed, J Kim, I Lin, ...
2013 IEEE International Electron Devices Meeting, 9.7. 1-9.7. 4, 2013
302013
Methods, apparatus, and system for using filler cells in design of integrated circuit devices
UP Schroeder, S Davar
US Patent 9,547,741, 2017
282017
Resolution enhancement for alternating phase shift masks
UP Schroeder, T Mono, V Klee
US Patent 6,605,396, 2003
282003
‘Via first’dual damascene process for copper metallization
G Brase, UP Schroeder, KL Holloway
US Patent 6,576,550, 2003
242003
Method of improving the etch resistance of chemically amplified photoresists by introducing silicon after patterning
UP Schroeder, G Kunkel, A Gutmann, B Spuler
US Patent 6,379,869, 2002
242002
Mechanical and stress‐optical properties of strongly swollen hydrogels
UP Schröder, W Oppermann
Makromolekulare Chemie. Macromolecular Symposia 76 (1), 63-74, 1993
241993
Liquid crystalline light-modulating device
A Afzali-Arkadani, GA Held, AC Lowe, RD Miller, UP Schroeder, RJ Twieg
US Patent 6,540,938, 2003
212003
Etch process for recessing polysilicon in trench structures
S Kudelka, H Tews, A Michaelis, U Schroeder, M Popp, K Schupke, ...
US Patent 6,740,595, 2004
192004
Computer simulation of network formation via crosslinking copolymerization
UP Schröder, W Oppermann
Macromolecular theory and simulations 6 (1), 151-160, 1997
161997
Dynamic light scattering studies of cholesteric and polymer-stabilized cholesteric liquid crystals
R Borsali, UP Schroeder, DY Yoon, R Pecora
Physical Review E 58 (3), R2717, 1998
151998
Method of forming a gate contact structure and source/drain contact structure for a semiconductor device
UP Schroeder
US Patent 10,276,674, 2019
142019
Methodology to extract, data mine and score geometric constructs from physical design layouts for analysis and applications in semiconductor manufacturing
P Pathak, K Krishnamoorthy, WL Wang, YC Lai, FE Gennari, S Somani, ...
Design-Process-Technology Co-optimization for Manufacturability X 9781, 77-88, 2016
142016
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