Ferroelectricity in HfO2 enables nonvolatile data storage in 28 nm HKMG J Müller, E Yurchuk, T Schlösser, J Paul, R Hoffmann, S Müller, D Martin, ... 2012 symposium on VLSI technology (VLSIT), 25-26, 2012 | 296 | 2012 |
Influence of the cross-linker reactivity on the formation of inhomogeneities in hydrogels B Lindemann, UP Schröder, W Oppermann Macromolecules 30 (14), 4073-4077, 1997 | 95 | 1997 |
A 0.13/spl mu/m CMOS platform with Cu/low-k interconnects for system on chip applications T Schiml, S Biesemans, G Brase, L Burrell, A Cowley, KC Chen, ... 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No …, 2001 | 84 | 2001 |
Properties of polyelectrolyte gels UP Schröder, W Oppermann Physical properties of polymeric gels, 19-38, 1996 | 60 | 1996 |
A modular 0.13/spl mu/m bulk CMOS technology for high performance and low power applications LK Han, S Biesemans, J Heidenreich, K Houlihan, C Lin, V McGahay, ... 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No …, 2000 | 37 | 2000 |
Nanosecond laser anneal (NLA) for Si-implanted HfO2 ferroelectric memories integrated in back-end of line (BEOL) L Grenouillet, T Francois, J Coignus, S Kerdiles, N Vaxelaire, ... 2020 IEEE Symposium on VLSI Technology, 1-2, 2020 | 34 | 2020 |
Physical Properties of Polymeric Gels UP Schröder, W Oppermann, CA JP John Wiley and Sons, Ch. Properties of Polyelectrolyte Gels, 19-38, 1996 | 32 | 1996 |
Polymer-stabilized reflective cholesteric displays: effects of chiral polymer networks on reflectance properties DJ Dyer, UP Schröder, KP Chan, RJ Twieg Chemistry of materials 9 (7), 1665-1669, 1997 | 31 | 1997 |
Innovations in special constructs for standard cell libraries in sub 28nm technologies M Rashed, N Jain, J Kim, M Tarabbia, I Rahim, S Ahmed, J Kim, I Lin, ... 2013 IEEE International Electron Devices Meeting, 9.7. 1-9.7. 4, 2013 | 30 | 2013 |
Methods, apparatus, and system for using filler cells in design of integrated circuit devices UP Schroeder, S Davar US Patent 9,547,741, 2017 | 28 | 2017 |
Resolution enhancement for alternating phase shift masks UP Schroeder, T Mono, V Klee US Patent 6,605,396, 2003 | 28 | 2003 |
‘Via first’dual damascene process for copper metallization G Brase, UP Schroeder, KL Holloway US Patent 6,576,550, 2003 | 24 | 2003 |
Method of improving the etch resistance of chemically amplified photoresists by introducing silicon after patterning UP Schroeder, G Kunkel, A Gutmann, B Spuler US Patent 6,379,869, 2002 | 24 | 2002 |
Mechanical and stress‐optical properties of strongly swollen hydrogels UP Schröder, W Oppermann Makromolekulare Chemie. Macromolecular Symposia 76 (1), 63-74, 1993 | 24 | 1993 |
Liquid crystalline light-modulating device A Afzali-Arkadani, GA Held, AC Lowe, RD Miller, UP Schroeder, RJ Twieg US Patent 6,540,938, 2003 | 21 | 2003 |
Etch process for recessing polysilicon in trench structures S Kudelka, H Tews, A Michaelis, U Schroeder, M Popp, K Schupke, ... US Patent 6,740,595, 2004 | 19 | 2004 |
Computer simulation of network formation via crosslinking copolymerization UP Schröder, W Oppermann Macromolecular theory and simulations 6 (1), 151-160, 1997 | 16 | 1997 |
Dynamic light scattering studies of cholesteric and polymer-stabilized cholesteric liquid crystals R Borsali, UP Schroeder, DY Yoon, R Pecora Physical Review E 58 (3), R2717, 1998 | 15 | 1998 |
Method of forming a gate contact structure and source/drain contact structure for a semiconductor device UP Schroeder US Patent 10,276,674, 2019 | 14 | 2019 |
Methodology to extract, data mine and score geometric constructs from physical design layouts for analysis and applications in semiconductor manufacturing P Pathak, K Krishnamoorthy, WL Wang, YC Lai, FE Gennari, S Somani, ... Design-Process-Technology Co-optimization for Manufacturability X 9781, 77-88, 2016 | 14 | 2016 |