Interfacial microstructures and thermodynamics of thermosonic Cu-wire bonding J Li, L Liu, L Deng, B Ma, F Wang, L Han IEEE Electron Device Letters 32 (10), 1433-1435, 2011 | 97 | 2011 |
Dispensing of high concentration Ag nano-particles ink for ultra-low resistivity paper-based writing electronics F Wang, P Mao, H He Scientific reports 6 (1), 21398, 2016 | 59 | 2016 |
Theoretical and experimental analyses of atom diffusion characteristics on wire bonding interfaces J Li, W Fuliang, L Han, J Zhong Journal of Physics D: Applied Physics 41 (13), 135303, 2008 | 47 | 2008 |
Effect of ultrasound on copper filling of high aspect ratio through-silicon via (TSV) H Xiao, F Wang, Y Wang, H He, W Zhu Journal of The Electrochemical Society 164 (4), D126, 2017 | 39 | 2017 |
High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition F Wang, P Zeng, Y Wang, X Ren, H Xiao, W Zhu Microelectronic Engineering 180, 30-34, 2017 | 38 | 2017 |
Ultrasonic vibration at thermosonic flip-chip bonding interface F Wang, Y Chen, L Han IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6 …, 2011 | 38 | 2011 |
Stress-induced atom diffusion at thermosonic flip chip bonding interface F Wang, L Han, J Zhong Sensors and Actuators A: Physical 149 (1), 100-105, 2009 | 37 | 2009 |
Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities F Wang, Z Zhao, N Nie, F Wang, W Zhu Scientific Reports 7 (1), 46639, 2017 | 34 | 2017 |
Parameters analysis of TSV filling models of distinct chemical behaviours of additives Y Wang, W Zhu, X Li, F Wang Electrochimica Acta 221, 70-79, 2016 | 32 | 2016 |
Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns F Wang, H Xiao, H He Scientific reports 6 (1), 26270, 2016 | 29 | 2016 |
Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives H Xiao, H He, X Ren, P Zeng, F Wang Microelectronic Engineering 170, 54-58, 2017 | 28 | 2017 |
Ultrasonic-assisted sintering of silver nanoparticles for flexible electronics F Wang, N Nie, H He, Z Tang, Z Chen, W Zhu The Journal of Physical Chemistry C 121 (51), 28515-28519, 2017 | 23 | 2017 |
Experimental and modeling study of breakup behavior in silicone jet dispensing for light-emitting diode packaging Y Chen, F Wang, HX Li IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (7 …, 2015 | 22 | 2015 |
Ultrasonic effects in the thermosonic flip chip bonding process F Wang, L Han IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (2 …, 2012 | 22 | 2012 |
Bondability window and power input for wire bonding L Han, F Wang, W Xu, J Zhong Microelectronics Reliability 46 (2-4), 610-615, 2006 | 22 | 2006 |
Parametric electrochemical deposition of controllable morphology of copper micro-columns F Wang, F Wang, H He Journal of The Electrochemical Society 163 (10), E322, 2016 | 21 | 2016 |
Modeling and experimental study of the kink formation process in wire bonding F Wang, Y Chen, L Han IEEE Transactions on Semiconductor Manufacturing 27 (1), 51-59, 2012 | 21 | 2012 |
Dynamics of free air ball formation in thermosonic wire bonding F Wang, K Xiang, L Han IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (8 …, 2012 | 21 | 2012 |
Graphene/glycerin solution-based multifunctional stretchable strain sensor with ultra-high stretchability, stability, and sensitivity Z Qi, H Bian, Y Yang, N Nie, F Wang Nanomaterials 9 (4), 617, 2019 | 20 | 2019 |
Effect of via depth on the TSV filling process for different current densities F Wang, Z Zhao, N Nie, F Wang, W Zhu Journal of Micromechanics and Microengineering 28 (4), 045004, 2018 | 20 | 2018 |