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Fuliang Wang
Fuliang Wang
在 csu.edu.cn 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Interfacial microstructures and thermodynamics of thermosonic Cu-wire bonding
J Li, L Liu, L Deng, B Ma, F Wang, L Han
IEEE Electron Device Letters 32 (10), 1433-1435, 2011
972011
Dispensing of high concentration Ag nano-particles ink for ultra-low resistivity paper-based writing electronics
F Wang, P Mao, H He
Scientific reports 6 (1), 21398, 2016
592016
Theoretical and experimental analyses of atom diffusion characteristics on wire bonding interfaces
J Li, W Fuliang, L Han, J Zhong
Journal of Physics D: Applied Physics 41 (13), 135303, 2008
472008
Effect of ultrasound on copper filling of high aspect ratio through-silicon via (TSV)
H Xiao, F Wang, Y Wang, H He, W Zhu
Journal of The Electrochemical Society 164 (4), D126, 2017
392017
High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition
F Wang, P Zeng, Y Wang, X Ren, H Xiao, W Zhu
Microelectronic Engineering 180, 30-34, 2017
382017
Ultrasonic vibration at thermosonic flip-chip bonding interface
F Wang, Y Chen, L Han
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6 …, 2011
382011
Stress-induced atom diffusion at thermosonic flip chip bonding interface
F Wang, L Han, J Zhong
Sensors and Actuators A: Physical 149 (1), 100-105, 2009
372009
Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities
F Wang, Z Zhao, N Nie, F Wang, W Zhu
Scientific Reports 7 (1), 46639, 2017
342017
Parameters analysis of TSV filling models of distinct chemical behaviours of additives
Y Wang, W Zhu, X Li, F Wang
Electrochimica Acta 221, 70-79, 2016
322016
Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns
F Wang, H Xiao, H He
Scientific reports 6 (1), 26270, 2016
292016
Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives
H Xiao, H He, X Ren, P Zeng, F Wang
Microelectronic Engineering 170, 54-58, 2017
282017
Ultrasonic-assisted sintering of silver nanoparticles for flexible electronics
F Wang, N Nie, H He, Z Tang, Z Chen, W Zhu
The Journal of Physical Chemistry C 121 (51), 28515-28519, 2017
232017
Experimental and modeling study of breakup behavior in silicone jet dispensing for light-emitting diode packaging
Y Chen, F Wang, HX Li
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (7 …, 2015
222015
Ultrasonic effects in the thermosonic flip chip bonding process
F Wang, L Han
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (2 …, 2012
222012
Bondability window and power input for wire bonding
L Han, F Wang, W Xu, J Zhong
Microelectronics Reliability 46 (2-4), 610-615, 2006
222006
Parametric electrochemical deposition of controllable morphology of copper micro-columns
F Wang, F Wang, H He
Journal of The Electrochemical Society 163 (10), E322, 2016
212016
Modeling and experimental study of the kink formation process in wire bonding
F Wang, Y Chen, L Han
IEEE Transactions on Semiconductor Manufacturing 27 (1), 51-59, 2012
212012
Dynamics of free air ball formation in thermosonic wire bonding
F Wang, K Xiang, L Han
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (8 …, 2012
212012
Graphene/glycerin solution-based multifunctional stretchable strain sensor with ultra-high stretchability, stability, and sensitivity
Z Qi, H Bian, Y Yang, N Nie, F Wang
Nanomaterials 9 (4), 617, 2019
202019
Effect of via depth on the TSV filling process for different current densities
F Wang, Z Zhao, N Nie, F Wang, W Zhu
Journal of Micromechanics and Microengineering 28 (4), 045004, 2018
202018
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