Mechanical anisotropy and strain rate dependency behavior of Ti6Al4V produced using E-beam additive fabrication L Ladani, J Razmi, S Farhan Choudhury Journal of Engineering Materials and Technology 136 (3), 031006, 2014 | 85 | 2014 |
Local shear stress-strain response of Sn-3.5 Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis SF Choudhury, L Ladani Journal of Alloys and Compounds 680, 665-676, 2016 | 55 | 2016 |
Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis SF Choudhury, L Ladani Journal of Electronic Materials 43 (4), 996-1004, 2014 | 53 | 2014 |
Effect of intermetallic compounds on the thermomechanical fatigue life of three-dimensional integrated circuit package microsolder bumps: finite element analysis and study SF Choudhury, L Ladani Journal of Electronic Packaging 137 (4), 041003, 2015 | 28 | 2015 |
Single Crystal Plasticity Finite Element Analysis of Cu6Sn5 Intermetallic SF Choudhury, L Ladani Metallurgical and Materials Transactions A 46 (3), 1108-1118, 2014 | 18 | 2014 |
Effect of varying test parameters on elastic–plastic properties extracted by nanoindentation tests L Ladani, E Harvey, SF Choudhury, CR Taylor Experimental Mechanics 53, 1299-1309, 2013 | 17 | 2013 |
An Approach on Performance Comparison Between Automotive Passive Suspension and Active Suspension System (PID Controller) Using MATLAB/Simulink SF Choudhury, MAR Sarkar Journal of Theoretical & Applied Information Technology 43 (2), 2012 | 17 | 2012 |
Miniaturization of micro-solder bumps and effect of IMC on stress distribution SF Choudhury, L Ladani Journal of Electronic Materials 45, 3683-3694, 2016 | 14 | 2016 |
Anisotropic Behavior of Single Grain Cu6Sn5 Intermetallic SF Choudhury, L Ladani ASME international mechanical engineering congress and exposition 46590 …, 2014 | 3 | 2014 |
Intermetallic compounds and their effects on the mechanical performance of micro scale solder bonds SF Choudhury | 2 | 2016 |
Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu6Sn5 Intermetallic SF Choudhury, L Ladani International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 1 | 2013 |