Investigation of underfilling BGAs packages–Thermal fatigue VL Pham, J Xu, K Pan, J Wang, S Park, C Singh, H Wang 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2252-2258, 2020 | 23 | 2020 |
A study of substrate models and its effect on package warpage prediction VL Pham, H Wang, J Xu, J Wang, S Park, C Singh 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1130-1139, 2019 | 17 | 2019 |
Experimentally minimizing the gap distance between extra tall packages and PCB using the digital image correlation (DIC) method VL Pham, Y Niu, J Wang, H Wang, C Singh, S Park, C Zhong, SW Koh, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1593-1599, 2018 | 12 | 2018 |
Deformation of Display for Handheld Devices During Drop Impact C Singh, S Chaparala, C Zhou, B Zhang, SB Park 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1990-1995, 2016 | 6 | 2016 |
Comparative study of analytical models to predict warpage in microelectronics packages C Singh, Y Kim, S Park ASME International Mechanical Engineering Congress and Exposition 46590 …, 2014 | 5 | 2014 |
Measurement of Dynamic Response Parameters of an Underdamped System C Singh, S Chaparala, SB Park Dynamic Behavior of Materials, Volume 1: Proceedings of the 2016 Annual …, 2017 | 3 | 2017 |
A study of warpage of electronic package and effect of reflow C Singh State University of New York at Binghamton, 2014 | 3 | 2014 |
Dynamic Fracture of Brittle Materials C Singh State University of New York at Binghamton, 2018 | | 2018 |
Cloning, Expression, and Characterization of a Novel Putative Aldehyde Dehydrogenase from Escherichia coli K-12 Which Is Highly Active on 3-Hydroxypropionaldehyde JE Jo, SM Raj, CR Singh, SH Park 한국생물공학회 학술대회, 197-197, 2008 | | 2008 |