| Development of next generation flip chip interconnection technology using homogenized laser-assisted bonding Y Jung, D Ryu, M Gim, C Kim, Y Song, J Kim, J Yoon, C Lee 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 88-94, 2016 | 39 | 2016 |
| Development of large die fine pitch flip chip BGA using TCNCP technology Y Jung, M Lee, S Park, D Ryu, Y Jung, C Hwang, C Lee, S Park, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 439-443, 2012 | 25 | 2012 |
| Compositionally bilayered feature of interfacial voids in a porous anodic alumina template directly formed on Si HS Seo, YG Jung, SW Jee, JM Yang, JH Lee Scripta Materialia 57 (10), 968-971, 2007 | 19 | 2007 |
| System and method for laser assisted bonding of semiconductor die TH Yoon, YG Jung, MH Kim, YS Song, DS Ryu, CH Kim US Patent 9,916,989, 2018 | 14 | 2018 |
| Effect of oxide thickness on the low temperature (≤ 400° C) growth of cone-shaped silicon nanowires YG Jung, SW Jee, JH Lee Journal of Applied Physics 102 (4), 2007 | 12 | 2007 |
| Development of extremely thin profile flip chip CSP using laser assisted bonding technology CH Kim, Y Jung, MH Kim, TH Yoon, YS Song, SH Na, DJ Park, BW Cho, ... 2017 IEEE CPMT Symposium Japan (ICSJ), 45-49, 2017 | 11 | 2017 |
| Laser assisted bonding for semiconductor die interconnections DS Ryu, CH Lee, MH Kim, CH Kim, JH Yoon, CH Hwang, YG Jung US Patent 9,627,348, 2017 | 11 | 2017 |
| Minho Gim, Choonghoe Kim, Yunseok Song, Jinyoung Kim, Juhoon Yoon, Choonheung Lee,“Development of Next Generation Flip Chip Interconnection Technology using Homogenized Laser … Y Jung, D Ryu Proc. IEEE Electronic Components and Technology Conf.(ECTC 16), 392-400, 2016 | 10 | 2016 |
| System and method for laser assisted bonding of semiconductor die TH Yoon, YG Jung, MH Kim, YS Song, DS Ryu, CH Kim US Patent 10,304,698, 2019 | 5 | 2019 |
| System and method for laser assisted bonding of an electronic device TH Yoon, YG Jung, MH Kim, YS Song, DS Ryu, CH Kim US Patent 10,763,129, 2020 | 1 | 2020 |
| System and method for laser assisted bonding of an electronic device TH Yoon, YG Jung, MH Kim, YS Song, DS Ryu, CH Kim US Patent App. 18/238,729, 2024 | | 2024 |
| System and method for laser assisted bonding of an electronic device TH Yoon, YG Jung, MH Kim, YS Song, DS Ryu, CH Kim US Patent 11,742,216, 2023 | | 2023 |
| Epitaxial insertion of Au_5Si nanodiscs during the growth of silicon nanowires UM Han-Don, J Yang-Gyoo, SEO Hong-Seok, P Kwang-Tae, ... Extended abstracts of the... Conference on Solid State Devices and Materials …, 2007 | | 2007 |
| Epitaxial insertion of Au5Si nanodiscs during the growth of silicon nanowires HD Um, YG Jung, HS Seo, KT Park, JH Lee 일본응용물리학회, 2007 | | 2007 |
| Vertical Growth of Si Nanowires Via Control of Dilute Gas Ratio HD Um, YG Jung, SW Jee, HS Seo, JH Lee Proceedings of the Materials Research Society of Korea Conference, 28.2-28.2, 2007 | | 2007 |
| Origin of Void Formation in a Porous Anodic Alumina Template on Si wafer HS Seo, YG Jung, SW Jee, HD Um, JH Lee Proceedings of the Materials Research Society of Korea Conference, 16.2-16.2, 2006 | | 2006 |
| Compositionally Bi-layered Formation of Interfacial Voids in a Porous Anodic Alumina Template Directly Formed on Si HS Seo, YG Jung, SW Jee, JM Yang, JH Lee Nanotechnology 16, 103, 2005 | | 2005 |
