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Peter de Bock
Peter de Bock
Department of Energy - ARPA-e
Verified email at hq.doe.gov - Homepage
Title
Cited by
Cited by
Year
Advanced high-power-density interior permanent magnet motor for traction applications
AM El-Refaie, JP Alexander, S Galioto, PB Reddy, KK Huh, P de Bock, ...
IEEE Transactions on Industry Applications 50 (5), 3235-3248, 2014
3012014
Thermal management system
DA Niergarth, A Delgado Jr, BW Miller, HPJ De Bock
US Patent App. 15/819,443, 2019
462019
Advanced thermoelectric materials and generator technology for automotive waste heat at GM
GP Meisner
2011 Thermoelectrics Applications Workshop, 1-37, 2011
432011
Thermal management system and method of assembling the same
ME Hendrik Pieter Jacobus De Bock, Jonathan Mark Dunsdon
US Patent US20150068703 A1, 2015
34*2015
Thermal clamp apparatus for electronic systems
G Refai-Ahmed, HPJ De Bock, YV Utturkar, CM Giovanniello
US Patent 9,668,334, 2017
332017
Multi-function synthetic jet and method of manufacturing same
HPJ De Bock, JA Vogel, TG Wetzel
US Patent 9,215,520, 2015
322015
Investigation and application of an advanced dual piezoelectric cooling jet to a typical electronics cooling configuration
HP De Bock, P Chamarthy, JL Jackson, B Whalen
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
322012
High performance heat transfer device, methods of manufacture thereof and articles comprising the same
BM Rush, HPJ De Bock, T Deng, BA Russ, KK Varanasi, SE Weaver Jr
US Patent App. 12/470,553, 2010
322010
Heat exchange assembly for use with electrical devices and methods of assembling an electrical device
SE Weaver Jr, T Deng, HPJ De Bock, SS Chauhan
US Patent 8,780,559, 2014
312014
A System to Package Perspective On Transient Thermal Management of Electronics
P de Bock, D Huitink, PJ Shamberger, J Lundh, S Choi, N Niedbalski, ...
Journal of Electronics Packaging 41111 (EP-20-1028), 11, 2020
302020
Thermal Management System
N Thiagarajan, HPJ de Bock, WD Gerstler
US Patent US9476651B2, 2016
302016
Experimental investigation of micro/nano heat pipe wick structures
HPJ de Bock, K Varanasi, P Chamarthy, T Deng, A Kulkarni, BM Rush, ...
ASME International Mechanical Engineering Congress and Exposition 48715, 991-996, 2008
292008
Thermal management system
BM Rush, N Thiagarajan, HPJ De Bock
US Patent 10,386,127, 2019
252019
Thermal-fluid modeling for high thermal conductivity heat pipe thermal ground planes
MT Ababneh, FM Gerner, P Chamarthy, P Bock, S Chauhan, T Deng
Journal of Thermophysics and Heat Transfer 28 (2), 270-278, 2014
252014
High performance heat transfer device, methods of manufacture thereof and articles comprising the same
KK Varanasi, P Chamarthy, HPJ De Bock, L Denault, T Deng, ...
US Patent App. 12/470,624, 2010
242010
On the Charging and Thermal Characterization of a micro/nano structured Thermal Ground Plane
HPJ de Bock, S Chauhan, P Chamarthy, SE Weaver, T Deng, FM Gerner, ...
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010
242010
Systems and methods for robust and modular synthetic jet cooling
HPJ De Bock, WD Gerstler, JM Dunsdon, SAM Lassini, WE Gross, ...
US Patent App. 13/963,473, 2015
202015
Article including thermal interface element and method of preparation
DM Shaddock, D Tao, HPJ De Bock, D Zhong, CM Eastman, ...
US Patent 8,405,996, 2013
192013
Thermal capacitance system
HPJ De Bock, JA Vogel, N Thiagarajan
US Patent 9,913,411, 2018
172018
Circuit card cartridge for an electronic system
HPJ De Bock, BM Rush, SAM Lassini
US Patent 9,974,157, 2018
162018
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