| The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer S Arefin, XP Li, M Rahman, K Liu The International Journal of Advanced Manufacturing Technology 31, 655-662, 2007 | 53 | 2007 |
| The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer S Arefin, XP Li, MB Cai, M Rahman, K Liu, A Tay Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2007 | 44 | 2007 |
| Effects of cutting edge radius in vibration assisted micro machining S Arefin, XQ Zhang, DWK Neo, AS Kumar International Journal of Mechanical Sciences 208, 106673, 2021 | 16 | 2021 |
| An analytical model for determining the shear angle in 1D vibration-assisted micro machining S Arefin, XQ Zhang, SK Anantharajan, K Liu, DWK Neo Nanomanufacturing and Metrology 2, 199-214, 2019 | 14 | 2019 |
| Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon S Arefin, XP Li, M Rahman, T He | 10 | 2005 |
| Elastic and plastic chip deformation mechanism in 1D vibration-assisted metal cutting XQ Zhang, S Arefin, AS Kumar, K Liu Procedia Cirp 71, 309-312, 2018 | 5 | 2018 |
| Effect of cutting edge radius in ductile mode cutting of brittle materials S AREFIN | 1 | 2004 |
| A Study of Material Removal Mechanism in Vibration Assisted Machining S Arefin PQDT-Global, 2020 | | 2020 |
LIU Kui (K Liu)Senior Scientist, Singapore Institute of Manufacturing TechnologyVerified email at simtech.a-star.edu.sg
