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Citations per year
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Cited by
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Since 2019
Citations
139
119
h-index
4
4
i10-index
4
4
0
30
15
2016
2017
2018
2019
2020
2021
2022
2023
2024
6
6
8
23
29
23
18
21
5
Public access
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Yaodong Wang
Apple Inc
Verified email at apple.com
Solder Joint Reliability
Articles
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Year
Materials, processing and reliability of low temperature bonding in 3D chip stacking
L Zhang, Z Liu, SW Chen, Y Wang, WM Long, Y Guo, S Wang, G Ye, ...
Journal of Alloys and Compounds 750, 980-995
, 2018
84
2018
Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints
Y Wang, IM De Rosa, KN Tu
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 632-639
, 2015
23
2015
Porous Cu3Sn Formation in Cu-Sn IMC-Based Micro-Joints
Y Wang
Electronic Components and Technology Conference, 439-446
, 2016
16
2016
Interconnect Quality and Reliability of 3D Packaging
Y Wang
Springer International Publishing 57, 375-420
, 2017
14
2017
Mechanical Reliability Challenges in Cu-Sn Microbump for 3D IC Packaging Technology
Y Wang
University of California, Los Angeles
, 2016
2
2016
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