| Plasma processing of low-k dielectrics MR Baklanov, JF de Marneffe, D Shamiryan, AM Urbanowicz, H Shi, ... Journal of Applied Physics 113 (4), 2013 | 351 | 2013 |
| Mechanistic study of plasma damage of low k dielectric surfaces J Bao, H Shi, J Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2008 | 116 | 2008 |
| Future on-chip interconnect metallization and electromigration CK Hu, J Kelly, H Huang, K Motoyama, H Shobha, Y Ostrovski, JHC Chen, ... 2018 ieee international reliability physics symposium (irps), 4F. 1-1-4F. 1-6, 2018 | 65 | 2018 |
| Role of ions, photons, and radicals in inducing plasma damage to ultra low-k dielectrics H Shi, H Huang, J Bao, J Liu, PS Ho, Y Zhou, JT Pender, MD Armacost, ... Journal of Vacuum Science & Technology B 30 (1), 2012 | 61 | 2012 |
| Experimental study of nanoscale Co damascene BEOL interconnect structures J Kelly, JHC Chen, H Huang, CK Hu, E Liniger, R Patlolla, B Peethala, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 53 | 2016 |
| Ruthenium interconnect resistivity and reliability at 48 nm pitch X Zhang, H Huang, R Patlolla, W Wang, FW Mont, J Li, CK Hu, EG Liniger, ... 2016 IEEE international interconnect technology conference/advanced …, 2016 | 52 | 2016 |
| Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires CK Hu, J Kelly, JHC Chen, H Huang, Y Ostrovski, R Patlolla, B Peethala, ... 2017 IEEE International Interconnect Technology Conference (IITC), 1-3, 2017 | 44 | 2017 |
| Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node BD Briggs, CB Peethala, DL Rath, J Lee, S Nguyen, NV LiCausi, ... 2017 IEEE International Electron Devices Meeting (IEDM), 14.2. 1-14.2. 4, 2017 | 38 | 2017 |
| Origin of dielectric loss induced by oxygen plasma on organo-silicate glass low-k dielectrics H Shi, J Bao, RS Smith, H Huang, J Liu, PS Ho, ML McSwiney, ... Applied Physics Letters 93 (19), 2008 | 38 | 2008 |
| Oxygen plasma damage to blanket and patterned ultralow-κ surfaces J Bao, H Shi, H Huang, PS Ho, ML McSwiney, MD Goodner, M Moinpour, ... Journal of Vacuum Science & Technology A 28 (2), 207-215, 2010 | 34* | 2010 |
| Exploring the limits of cobalt liner thickness in advanced copper interconnects NA Lanzillo, CC Yang, K Motoyama, H Huang, K Cheng, J Maniscalco, ... IEEE Electron Device Letters 40 (11), 1804-1807, 2019 | 31 | 2019 |
| O2 plasma damage and dielectric recoveries to patterned CDO low-k dielectrics H Huang, J Bao, H Shi, PS Ho, ML McSwiney, MD Goodner, M Moinpour, ... Advanced Metallization Conference, 2008 | 26 | 2008 |
| Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node T Nogami, X Zhang, J Kelly, B Briggs, H You, R Patlolla, H Huang, ... 2017 Symposium on VLSI Technology, T148-T149, 2017 | 25 | 2017 |
| Small angle X-ray scattering measurements of spatial dependent linewidth in dense nanoline gratings C Wang, WE Fu, B Li, H Huang, C Soles, EK Lin, W Wu, PS Ho, ... Thin Solid Films 517 (20), 5844-5847, 2009 | 21 | 2009 |
| Advanced single precursor based pSiCOH k= 2.4 for ULSI interconnects D Priyadarshini, SV Nguyen, H Shobha, E Liniger, JHC Chen, H Huang, ... Journal of Vacuum Science & Technology B 35 (2), 2017 | 19 | 2017 |
| IEEE International Interconnect Technology Conference J Kelly, JHC Chen, H Huang, CK Hu, E Liniger, R Patlolla, B Peethala, ... Advanced Metallization Conference (IITC/AMC)(San Jose, CA, United States of …, 2016 | 19 | 2016 |
| Mechanistic study of plasma damage and CH4 recovery of low k dielectric surface JJ Bao, HL Shi, JJ Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ... 2007 IEEE International Interconnect Technology Conferencee, 147-149, 2007 | 19 | 2007 |
| Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines T Nogami, R Patlolla, J Kelly, B Briggs, H Huang, J Demarest, J Li, ... 2017 IEEE International Interconnect Technology Conference (IITC), 1-3, 2017 | 16 | 2017 |
| Methods to lower the resistivity of ruthenium interconnects at 7 nm node and beyond X Zhang, H Huang, R Patlolla, FW Mont, X Lin, M Raymond, C Labelle, ... 2017 IEEE International Interconnect Technology Conference (IITC), 1-3, 2017 | 16 | 2017 |
| Fully aligned via with integrated air gaps BD Briggs, LA Clevenger, H Huang, CJ Penny, M Rizzolo, HK Shobha US Patent 9,966,337, 2018 | 13 | 2018 |
hualiang shiintelVerified email at intel.com
