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Scott Thompson
Scott Thompson
Professor of Electrical and Computer Engineering, University of Florida
Verified email at ece.ufl.edu - Homepage
Title
Cited by
Cited by
Year
A 90nm high volume manufacturing logic technology featuring novel 45nm gate length strained silicon CMOS transistors
T Ghani, M Armstrong, C Auth, M Bost, P Charvat, G Glass, T Hoffmann, ...
IEEE International Electron Devices Meeting 2003, 11.6. 1-11.6. 3, 2003
10542003
Moore's law: the future of Si microelectronics
SE Thompson, S Parthasarathy
Materials today 9 (6), 20-25, 2006
9952006
A 90-nm logic technology featuring strained-silicon
SE Thompson, M Armstrong, C Auth, M Alavi, M Buehler, R Chau, S Cea, ...
IEEE Transactions on electron devices 51 (11), 1790-1797, 2004
9152004
Uniaxial-process-induced strained-Si: Extending the CMOS roadmap
SE Thompson, G Sun, YS Choi, T Nishida
IEEE Transactions on electron Devices 53 (5), 1010-1020, 2006
7342006
A logic nanotechnology featuring strained-silicon
SE Thompson, M Armstrong, C Auth, S Cea, R Chau, G Glass, T Hoffman, ...
IEEE Electron Device Letters 25 (4), 191-193, 2004
6862004
Physics of strain effects in semiconductors and metal-oxide-semiconductor field-effect transistors
Y Sun, SE Thompson, T Nishida
Journal of Applied Physics 101 (10), 2007
6412007
MOS scaling: Transistor challenges for the 21st century
S Thompson
Intel Technology Journal 398, 1-19, 1998
6091998
A 90 nm logic technology featuring 50 nm strained silicon channel transistors, 7 layers of Cu interconnects, low k ILD, and 1/spl mu/m/sup 2/SRAM cell
S Thompson, N Anand, M Armstrong, C Auth, B Arcot, M Alavi, P Bai, ...
Digest. International Electron Devices Meeting,, 61-64, 2002
4522002
Strain: A solution for higher carrier mobility in nanoscale MOSFETs
M Chu, Y Sun, U Aghoram, SE Thompson
Annual Review of Materials Research 39, 203-229, 2009
4392009
Strain effect in semiconductors: theory and device applications
Y Sun, SE Thompson, T Nishida
Springer Science & Business Media, 2009
3872009
Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits and Applications of SiGe and Si Strained-Layer Epitaxy
JD Cressler, S Monfray, G Freeman, D Friedman, DJ Paul, S Tsujino, ...
CRC press, 2018
2972018
Key differences for process-induced uniaxial vs. substrate-induced biaxial stressed Si and Ge channel MOSFETs
S Thompson, G Sun, K Wu, J Lim, T Nishida
IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004
2782004
Scaling challenges and device design requirements for high performance sub-50 nm gate length planar CMOS transistors
T Ghani, K Mistry, P Packan, S Thompson, M Stettler, S Tyagi, M Bohr
2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No …, 2000
2722000
In search of" Forever," continued transistor scaling one new material at a time
SE Thompson, RS Chau, T Ghani, K Mistry, S Tyagi, MT Bohr
IEEE Transactions on semiconductor manufacturing 18 (1), 26-36, 2005
2612005
Comparison of threshold-voltage shifts for uniaxial and biaxial tensile-stressed n-MOSFETs
JS Lim, SE Thompson, JG Fossum
IEEE Electron Device Letters 25 (11), 731-733, 2004
2452004
Electronic devices and systems, and methods for making and using the same
SE Thompson, DR Thummalapally
US Patent 8,273,617, 2012
2392012
Delaying forever: Uniaxial strained silicon transistors in a 90nm CMOS technology
K Mistry, M Armstrong, C Auth, S Cea, T Coan, T Ghani, T Hoffmann, ...
Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004., 50-51, 2004
2072004
CMOS fabrication process utilizing special transistor orientation
M Armstrong, G Schrom, S Tyagi, PA Packan, KJ Kuhn, S Thompson
US Patent 7,312,485, 2007
1982007
A 130 nm generation logic technology featuring 70 nm transistors, dual Vt transistors and 6 layers of Cu interconnects
S Tyagi, M Alavi, R Bigwood, T Bramblett, J Brandenburg, W Chen, ...
International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No …, 2000
1792000
Hole mobility in silicon inversion layers: Stress and surface orientation
G Sun, Y Sun, T Nishida, SE Thompson
Journal of Applied Physics 102 (8), 2007
1332007
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