| Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs Y Zhang, H Oh, MS Bakir 2013 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2013 | 42 | 2013 |
| Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems TE Sarvey, Y Zhang, Y Zhang, H Oh, MS Bakir Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 32 | 2014 |
| In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation X Liu, PA Thadesar, CL Taylor, H Oh, M Kunz, N Tamura, MS Bakir, ... Applied Physics Letters 105 (11), 2014 | 26 | 2014 |
| Biomimetic extracellular matrix coatings improve the chronic biocompatibility of microfabricated subdural microelectrode arrays F Vitale, W Shen, N Driscoll, JC Burrell, AG Richardson, O Adewole, ... PLoS One 13 (11), e0206137, 2018 | 22 | 2018 |
| High-aspect ratio through-silicon vias for the integration of microfluidic cooling with 3D microsystems H Oh, JM Gu, SJ Hong, GS May, MS Bakir Microelectronic Engineering 142, 30-35, 2015 | 22 | 2015 |
| IEEE Trans. Elec. Dev. JF Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir IEEE Trans. Elec. Dev 63, 2510-2516, 2016 | 20 | 2016 |
| Design, fabrication, and characterization of dense compressible microinterconnects PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017 | 16 | 2017 |
| Low-loss air-isolated through-silicon vias for silicon interposers H Oh, PA Thadesar, GS May, MS Bakir IEEE Microwave and Wireless Components Letters 26 (3), 168-170, 2016 | 15 | 2016 |
| Dynamic thermal management for 3-D ICs with time-dependent power map using microchannel cooling and machine learning YS Li, H Yu, H Jin, TE Sarvey, H Oh, MS Bakir, M Swaminathan, EP Li IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019 | 13 | 2019 |
| High-frequency analysis of embedded microfluidic cooling within 3-D ICs using a TSV testbed H Oh, X Zhang, GS May, MS Bakir 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 68-73, 2016 | 13 | 2016 |
| A microwell-based impedance sensor on an insertable microneedle for real-time in vivo cytokine detection N Song, P Xie, W Shen, H Oh, Y Zhang, F Vitale, M Javanmard, MG Allen Microsystems & Nanoengineering 7 (1), 96, 2021 | 12 | 2021 |
| Electrical circuit modeling and validation of through-silicon vias embedded in a silicon microfluidic pin-fin heat sink filled with deionized water H Oh, M Swaminathan, GS May, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 11 | 2020 |
| Heterogeneous integrated microsystems with nontraditional through-silicon via technologies H Oh, GS May, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (4 …, 2017 | 11 | 2017 |
| Impact of on-chip interconnect on the performance of 3-D integrated circuits with through-silicon vias: Part II X Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir IEEE Transactions on Electron Devices 63 (6), 2510-2516, 2016 | 10 | 2016 |
| Fabrication and characterization of electrical interconnects and microfluidic cooling for 3D ICS with silicon interposer H Oh, Y Zhang, L Zheng, GS May, MS Bakir Heat Transfer Engineering 37 (11), 903-911, 2016 | 8 | 2016 |
| Impact of on-chip interconnect on the performance of 3-D integrated circuits with through silicon vias: Part i V Kumar, H Oh, X Zhang, L Zheng, MS Bakir, A Naeemi IEEE Transactions on Electron Devices 63 (6), 2503-2509, 2016 | 8 | 2016 |
| Fully additive fabrication of electrically anisotropic multilayer materials based on sequential electrodeposition M Synodis, JB Pyo, M Kim, H Oh, X Wang, MG Allen Journal of Microelectromechanical Systems 29 (6), 1510-1517, 2020 | 7 | 2020 |
| Analysis of signal propagation through TSVs within distilled water for liquid-cooled microsystems H Oh, GS May, MS Bakir IEEE Transactions on Electron Devices 63 (3), 1176-1181, 2016 | 7 | 2016 |
| TSVs embedded in a microfluidic heat sink: High-frequency characterization and thermal modeling H Oh, Y Zhang, TE Sarvey, GS May, MS Bakir 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), 1-4, 2016 | 6 | 2016 |
| Silicon interposer platform with low-loss through-silicon vias using air H Oh, GS May, MS Bakir 2015 International 3D Systems Integration Conference (3DIC), TS11. 3.1-TS11. 3.4, 2015 | 6 | 2015 |
Li ZhengGeorgia institute of technologyVerified email at gatech.edu
