| Process development for laser powder bed fusion of pure copper T Stoll, P Trautnitz, S Schmiedeke, J Franke, N Travitzky Laser 3D Manufacturing VII 11271, 24-38, 2020 | 12 | 2020 |
| A novel approach of copper-ceramic-joints manufactured by selective laser melting T Stoll, M Kirstein, J Franke Material Technologies and Applications to Optics, Structures, Components …, 2019 | 11 | 2019 |
| Additive manufacturing of 3D-copper-metallizations on alumina by means of selective laser melting for power electronic applications T Stoll, M Kirstein, J Franke CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 6 | 2018 |
| Is selective laser melting (SLM) an alternative for high-temperature mechatronic integrated devices? methodology, hurdles and prospects A Syed-Khaja, D Walawski, T Stoll, J Franke 2016 12th International Congress Molded Interconnect Devices (MID), 1-5, 2016 | 6 | 2016 |
| Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes T Stoll, A Syed-Khaja, J Franke International Symposium on Microelectronics 2017 (1), 000761-000767, 2017 | 5 | 2017 |
| Investigations in selective laser melting as manufacturing technology for the production of high-temperature mechatronic integrated devices A Syed-Khaja, T Stoll, J Franke 2016 11th International Microsystems, Packaging, Assembly and Circuits …, 2016 | 4 | 2016 |
| Laser Powder Bed Fusion of Copper on Alumina T Stoll FAU University Press, 2023 | 3 | 2023 |
| Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF) T Stoll, T Feuerer, A Hensel, J Franke Laser 3D Manufacturing IX 11992, 7-18, 2022 | 3 | 2022 |
| Electrical and mechanical qualification of selectively dispensed active brazes T Stoll, J Franke 2018 13th International Congress Molded Interconnect Devices (MID), 1-5, 2018 | 3 | 2018 |
| The future of short-range high-speed data transmission: printed polymer optical waveguides (POW) innovation, fabrication, and challenges T Reitberger, T Stoll, GA Hoffmann, L Lorenz, S Neermann, L Overmeyer, ... Optics and Photonics for Information Processing XII 10751, 44-50, 2018 | 3 | 2018 |
| A New Development of Micro-Copper Sinter Material for High Power Electronics Application C Schwarzer, LM Chew, T Stoll, J Franke, M Kaloudis CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 2 | 2020 |
| Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes A Hensel, C Schwarzer, C Merz, T Stoll, M Kaloudis, J Franke 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 627-633, 2019 | 2 | 2019 |
| Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring P Braeuer, T Stoll, M Muckelbauer, F Häußler, A Hensel, J Franke 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 91-96, 2022 | 1 | 2022 |
| Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies P Braeuer, T Stoll, M Muckelbauer, A Hensel, J Franke 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 992-999, 2022 | 1 | 2022 |
| Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating C Hecht, M Ockel, T Stoll, J Franke Laser 3D Manufacturing XI 12876, 59-69, 2024 | | 2024 |
| Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications C Hecht, E Schadow, M Sprenger, F Häußler, T Stoll, J Franke 2023 24th European Microelectronics and Packaging Conference & Exhibition …, 2023 | | 2023 |
| Investigations on processing copper-titanium powder blends via PBF-LB/M C Hecht, D Schueller, D Utsch, T Stoll, J Franke Laser in Manufacturing Conference 2023, 2023 | | 2023 |
| Strahlformung eröffnet neue Perspektiven im Metall-3-D-Druck K Wudy, T Stoll maschinenbau 2 (6), 8-11, 2022 | | 2022 |
