| Epitaxial metals for interconnects beyond Cu K Barmak, S Ezzat, R Gusley, A Jog, S Kerdsongpanya, A Khaniya, ... Journal of Vacuum Science & Technology A 38 (3), 2020 | 37 | 2020 |
| Electrochemical atomic layer deposition of copper: a lead-free process mediated by surface-limited redox replacement of underpotentially deposited zinc K Venkatraman, R Gusley, L Yu, Y Dordi, R Akolkar Journal of The Electrochemical Society 163 (12), D3008, 2016 | 34 | 2016 |
| Electrodeposition of Epitaxial Co on Ru (0001)/Al2O3 (0001) R Gusley, K Sentosun, S Ezzat, KR Coffey, AC West, K Barmak Journal of The Electrochemical Society 166 (15), D875, 2019 | 12 | 2019 |
| Electrochemistry-enabled atomic layer deposition of copper: Investigation of the deposit growth rate and roughness K Venkatraman, R Gusley, A Lesak, R Akolkar Journal of Vacuum Science & Technology A 37 (2), 2019 | 12 | 2019 |
| Influence of the Seed Layer and Electrolyte on the Epitaxial Electrodeposition of Co (0001) for the Fabrication of Single Crystal Interconnects R Gusley, S Ezzat, KR Coffey, AC West, K Barmak Journal of The Electrochemical Society 167 (16), 162503, 2020 | 11 | 2020 |
| Electrodeposition of Ru onto Ru and Au seed layers from solutions of ruthenium nitrosyl sulfate and ruthenium chloride R Gusley, Q Cumston, KR Coffey, AC West, K Barmak Journal of The Electrochemical Society 168 (5), 052504, 2021 | 4 | 2021 |
| Review–On Epitaxial Electrodeposition of Co, Cu, and Ru for Interconnect Applications K Barmak, RR Gusley Journal of The Electrochemical Society 169 (8), 082517, 2022 | 3 | 2022 |
| Electrodeposition of Cu (111) onto a Ru (0001) seed layer for epitaxial Cu interconnects RR Gusley, Q Cumston, KR Coffey, AC West, K Barmak Journal of Applied Physics 130 (13), 2021 | 1 | 2021 |
| Erratum:“Electrodeposition of Cu (111) onto a Ru (0001) seed layer for epitaxial Cu interconnects” J. Appl. Phys. 130, 135301 (2021) RR Gusley, Q Cumston, KR Coffey, AC West, K Barmak Journal of Applied Physics 131 (20), 2022 | | 2022 |
| Electrodeposition of Epitaxial Metals for the Fabrication of Single Crystal Interconnects RR Gusley Columbia University, 2021 | | 2021 |
| (Invited) Electrochemical Atomic Layer Deposition: Metal Deposition One Atomic Layer at a Time Enabled By Potential Pulsing & Self-Limiting Growth R Akolkar, Y Dordi, A Joi, K Venkatraman, R Gusley Electrochemical Society Meeting Abstracts 231, 1180-1180, 2017 | | 2017 |
| Electrochemical Atomic Layer Deposition of Copper Mediated By Underpotentially Deposited Zinc K Venkatraman, R Gusley, L Yu, Y Dordi, R Akolkar Electrochemical Society Meeting Abstracts 230, 1886-1886, 2016 | | 2016 |
| Department of Chemical and Biomolecular Engineering, Case Western Reserve University, 10900 Euclid Avenue, Cleveland, OH 44106 USA 2 Lam Research Corporation, 4650 Cushing … K Venkatraman, R Gusley, L Yu, Y Dordi, R Akolkar | | |
