Kihong Park

20212022202320241 4 13 15

Taesung KimSungkyunkwan UniversityVerified email at skku.edu
Pengzhan LiuSungkyunkwan UniversityVerified email at skku.edu
Kim EungchulSamsung ElectronicsVerified email at samsung.com
JAEWON LEESchool of Mechanical Engineering, Sungkyunkwan University (SKKU), Gyeonggi-do 16419, Republic ofVerified email at skku.edu
Jungryul LeeSungkyunkwan UniversityVerified email at skku.edu
Seunghwan LeeSungkyunkwan UniversityVerified email at g.skku.edu
Seulgi ChoiEngineer of Etch, Lam ResearchVerified email at skku.edu

Kihong Park

Verified email at skku.edu - Homepage


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Development of a novel wet cleaning solution for Post-CMP SiO2 and Si3N4 films J Song, K Park, S Jeon, J Lee, T Kim Materials Science in Semiconductor Processing 140, 106353, 2022	11	2022
Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization S Jeon, J Lee, S Hong, H Seo, Y Cho, P Liu, K Park, T Kim Materials Science in Semiconductor Processing 138, 106280, 2022	8	2022
The mechanical effect of soft pad on copper chemical mechanical polishing P Liu, Y Nam, S Lee, E Kim, S Jeon, K Park, S Hong, T Kim Materials Science in Semiconductor Processing 155, 107256, 2023	6	2023
Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments L Xu, K Park, H Lei, P Liu, E Kim, Y Cho, T Kim, C Chen Friction 11 (9), 1624-1640, 2023	5	2023
Quadrature moment simulation of silica nanoparticles aggregation and breakage in chemical mechanical polishing S Choi, G Im, E Kim, K Park, T Kim Journal of Industrial and Engineering Chemistry 107, 207-214, 2022	3	2022

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