| Scaffold characteristics, fabrication methods, and biomaterials for the bone tissue engineering JW Jang, KE Min, C Kim, J Shin, J Lee, S Yi International Journal of Precision Engineering and Manufacturing 24 (3), 511-529, 2023 | 32 | 2023 |
| Effects of Catalysts on the adhesive properties for flip chip bonding KE Min, JS Lee, SH Yoo, MS Kim, JK Kim Korean Journal of Materials Research 20 (12), 681-685, 2010 | 12 | 2010 |
| PCL and DMSO2 Composites for Bio-Scaffold Materials JW Jang, KE Min, C Kim, C Wern, S Yi Materials 16 (6), 2481, 2023 | 8 | 2023 |
| New frontiers of laser welding technology KE Min, JW Jang, C Kim Applied Sciences 13 (3), 1840, 2023 | 5 | 2023 |
| Thermophysical Properties of Inorganic Phase-Change Materials Based on MnCl2·4H2O KE Min, JW Jang, JK Kim, C Wern, S Yi Applied Sciences 12 (13), 6338, 2022 | 5 | 2022 |
| Thermo-viscoelastic characterization of 3D printing polymers S Yi, N Oh, KE Min, JS Shin, C Kim Applied Sciences 13 (5), 2876, 2023 | 4 | 2023 |
| Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste HY Kim, KE Min, JS Lee, SJ Lee, SS Lee, JK Kim Electronic Materials Letters 12, 48-53, 2016 | 4 | 2016 |
| Effects of hardeners and catalysts on the reliability of copper to copper adhesive Joint KE Min, HY Kim, JH Bang, JH Kim, JK Kim Korean Journal of Materials Research 21 (5), 283-287, 2011 | 3 | 2011 |
| Role of binder on yield strength of polycaprolactone/dimethylsulfone composites for bio-applications KE Min, JW Jang, S Yi, C Kim Journal of Materials Research and Technology 27, 462-471, 2023 | 2 | 2023 |
| A Study of Thermal Energy Storage of Phase Change Materials: Thermophysical Properties and Numerical Simulations KE Min | 2 | 2019 |
| Evaluation method for snap cure behavior of non-conductive paste for flip chip bonding KE Min, JS Lee, SJ Lee, S Yi, JK Kim Journal of Welding and Joining 33 (5), 41-46, 2015 | 2 | 2015 |
| Development of Prediction Method for Dimensional Stability of 3D-Printed Objects KE Min, JW Jang, J Shin, C Kim, S Yi Applied Sciences 13 (19), 11027, 2023 | 1 | 2023 |
| Prediction of Curing Time/Shear Strength of Non-Conductive Adhesives Using a Neural Network Model KE Min, JW Jang, JK Kim, S Yi, C Kim Applied Sciences 12 (23), 12150, 2022 | 1 | 2022 |
| Rheological Properties and 3D Printing Behavior of PCL and DMSO2 Composites for Bio-Scaffold JW Jang, KE Min, C Kim, C Wern, S Yi Materials 17 (10), 2459, 2024 | | 2024 |
| Identification of Solder Joint Failure Modes Using Machine Learning KE Min, JW Jang, C Kim, S Yi IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | | 2023 |
| Scaffold Characteristics, Fabrication Methods, and Biomaterials for the Bone Tissue Engineering (vol 24, pg 511, 2023) JW Jang, KE Min, C Kim, J Shin, J Lee, S Yi INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING 24 (5), 887-887, 2023 | | 2023 |
