| Post-CMP cleaning solutions for the removal of organic contaminants with reduced galvanic corrosion at copper/cobalt interface for advanced Cu interconnect applications J Seo, SH Vegi, SV Babu ECS Journal of Solid State Science and Technology 8 (8), P379, 2019 | 40 | 2019 |
| Formation of cobalt-BTA complexes and their removal from various surfaces relevant to cobalt interconnect applications J Seo, SH Vegi, CK Ranaweera, NK Baradanahalli, JH Han, D Koli, ... ECS Journal of Solid State Science and Technology 8 (5), P3009, 2018 | 36 | 2018 |
| Real-time visualization of the cleaning of ceria particles from silicon dioxide films using PVA brush scrubbing CK Ranaweera, P Khajornrungruang, S Hamada, A Gowda, H Vegi, ... ECS Journal of Solid State Science and Technology 10 (8), 084004, 2021 | 8 | 2021 |
| Storage Temperature Effects on the Slurry Health Parameters and SiO2 Removal Rates during Chemical Mechanical Polishing J Seo, A Othman, HJ Kim, J Devabhaktuni, R Trivedi, D Penigalapati, ... ECS Journal of Solid State Science and Technology 10 (10), 104002, 2021 | 1 | 2021 |
| Formulation of Post Cobalt CMP Cleaning Solution Based on Stability Constants of Metal Complexes SH Vegi, J Seo, CK Ranaweera, NK Baradanahalli, SV Babu 2019 AIChE Annual Meeting, 2019 | 1 | 2019 |
S.V. BabuClarkson UniversityVerified email at clarkson.edu
