Utkarsh Misra

2021202220231 3 1

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Md Rubayat-E TanjilInstructor, Department of Mechanical and Aerospace Eng., University of Colorado, Colorado SpringsVerified email at uccs.edu
Michael Cai WangUniversity of South Florida - TampaVerified email at usf.edu
T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp

Utkarsh Misra

Undergraduate Research Assistant, University of South Florida

Verified email at usf.edu - Homepage


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Mitigation of electromigration in metal interconnects via hexagonal boron nitride as an Ångström‐thin passivation layer Y Jeong, O Douglas, U Misra, MRE Tanjil, K Watanabe, T Taniguchi, ... Advanced Electronic Materials 7 (6), 2100002, 2021	5	2021
Controllable Conductance Quantization in Electrochemical Metallization Based Tantalum Oxide Crossbar RRAM Devices U Misra, V Sahu, A Mahapatra, AK Das, RS Ajimsha, P Misra Authorea Preprints, 2023		2023
Conductance Quantization in Cu/Ta2O5/Pt Resistive Random Access Memory Devices U Misra, V Sahu, AK Das, RS Ajimsha, P Misra TechRxiv, 2023		2023
Performance of ReS2 as Channel Material for (Photo) Transistors: DAAD Rise 2022 Report U Misra		2022
Hexagonal Boron Nitride: Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer (Adv. Electron. Mater. 6/2021) Y Jeong, O Douglas, U Misra, MRE Tanjil, K Watanabe, T Taniguchi, ... Advanced Electronic Materials 7 (6), 2170020, 2021		2021

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