| On the mechanical stresses of cu through-silicon via (tsv) samples fabricated by sk hynix vs. sematech–enabling robust and reliable 3-d interconnect/integrated circuit (ic … T Tian, R Morusupalli, H Shin, HY Son, KY Byun, YC Joo, R Caramto, ... Procedia Engineering 139, 101-111, 2016 | 39 | 2016 |
| Critical temperature shift for Stress Induced Voiding in advanced Cu interconnects for 32 nm and beyond R Morusupalli, R Rao, TK Lee, YL Shen, M Kunz, N Tamura, AS Budiman 2012 IEEE International Reliability Physics Symposium (IRPS), EM. 8.1-EM. 8.3, 2012 | 6 | 2012 |
| Comparison of Line stress predictions with measured electromigration failure times RR Morusupalli, WD Nix, JR Patel 2007 IEEE International Integrated Reliability Workshop Final Report, 124-127, 2007 | 3 | 2007 |
| Addressing IC component Quality and Reliability assurance challenges SJ Wen, RR Morusupalli, M Hartranft 2009 IEEE International Reliability Physics Symposium, 810-813, 2009 | 2 | 2009 |
| Tae-Kyu Lee; Yu-Lin Shen; Kunz, M.; Tamura, N.; Budiman, AS “Critical temperature shift for Stress Induced Voiding in Advanced Cu Interconnects for 32 nm and beyond” R Morusupalli, R Rao IEEE IRPS, Pages EM, 0 | 2 | |
| Critical temperature shift for stress induced voiding in advanced Cu interconnects for 32 nm and beyond R Morusupalli, R Rao, TK Lee, YL Shen, M Kunz, N Tamura, AS Budiman Procedia Engineering 139, 32-40, 2016 | 1 | 2016 |
| From Early Discoveries to a New Hypothesis-A Brief History of Atomic Magnetism and Magnetic Monopoles RR Morusupalli 2023 8th IEEE History of Electrotechnology Conference (HISTELCON), 11-15, 2023 | | 2023 |
| Impact of Lorentz Force On Atomic Flux During Electromigration RR Morusupalli, DL Littlefield, WD Nix 2021 IEEE International Integrated Reliability Workshop (IIRW), 1-4, 2021 | | 2021 |
| Plasticity and Reliability: From Unexpected Plasticity-Induced Damages in Advanced Cu Interconnects to Novel Reliability Phenomena in 3-D Interconnect Schemes Using Through … A Budiman, R Morusupalli, TK Lee, YL Shen, SH Hwang, BJ Kim, HY Son, ... Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2011 | | 2011 |
| Plastic Relaxation during Thermal Loading in Advanced Cu Interconnects at Intermediate Temperatures: Implications for Stress-induced Voiding (SIV) in Advanced Interconnect Nodes R Morusupalli Advanced Metallization Conference 2010, 51-53, 2010 | | 2010 |
| 2007 IIRW Attendees S Kayali, R Brynsvold, M Yap, D Turner, R Morusupalli, S Pae, A Johnston, ... | | |
