Skip-vias bypassing a metallization level at minimum pitch BD Briggs, LA Clevenger, BH DeProspo, H Huang, CJ Penny, ... US Patent App. 10/083,905, 2018 | 41* | 2018 |
Dynamic rigidity mechanism BD Briggs, LA Clevenger, BH DeProspo, M RIZZOLO US Patent App. 10/099,108, 2018 | 23* | 2018 |
Innovative Sub-5- m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects F Liu, G Khurana, R Zhang, A Watanabe, BH DeProspo, C Nair, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 22 | 2019 |
Heterogeneous integration for artificial intelligence: Challenges and opportunities S Mukhopadhyay, Y Long, B Mudassar, CS Nair, BH DeProspo, ... IBM Journal of Research and Development 63 (6), 4: 1-4: 1, 2019 | 21 | 2019 |
Heterogeneous and homogeneous package integration technologies at device and system levels R Tummala, N Nedumthakady, S Ravichandran, B DeProspo, ... 2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5, 2018 | 21 | 2018 |
Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics F Liu, R Zhang, BH DeProspo, S Dwarakanath, P Nimbalkar, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1132-1139, 2020 | 18 | 2020 |
Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5 D Interposer RDL C Nair, B DeProspo, H Hichri, M Arendt, F Liu, V Sundaram, R Tummala 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1005-1009, 2018 | 15 | 2018 |
Fundamental Interdiffusion Analysis of Ruthenium and Cobalt Films B DeProspo | 15 | 2016 |
Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study F Liu, R Zhang, G Khurana, BH Deprospo, RR Tummala, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 14 | 2020 |
Next Generation of 2-7 Micron Ultra-Small Microvias for 2.5 D Panel Redistribution Layer by Using Laser and Photolithography Technologies F Liu, C Nair, G Khurana, A Watanabe, BH DeProspo, A Kubo, CP Lin, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 924-930, 2019 | 14 | 2019 |
Low-Cost 1- m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL F Liu, C Nair, H Ito, BH DeProspo, S Ravichandran, H Akimaru, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019 | 11 | 2019 |
Glass Panel Packaging, as the Most Leading-Edge Packaging: Technologies and Applications R Tummala, B Deprospo, S Dwarakanath, S Ravichandran, P Nimbalkar, ... 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5, 2020 | 10 | 2020 |
Skip-vias bypassing a metallization level at minimum pitch BD Briggs, LA Clevenger, BH DeProspo, H Huang, CJ Penny, M Rizzolo US Patent 9,911,651, 2018 | 9 | 2018 |
Forming chamferless vias using thermally decomposable porefiller BD Briggs, LA Clevenger, BH DeProspo, H Huang, CJ Penny, MR Rizzolo US Patent 9,685,366, 2017 | 8 | 2017 |
Integrated copper heat slugs and emi shields in panel laminate (lfo) and glass fanout (gfo) packages for high power rf ics V Sundaram, B Deprospo, N Gezgin, A Watanabe, PM Raj, F Liu, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 300-305, 2017 | 8 | 2017 |
High-density MIM capacitors BD Briggs, LA Clevenger, BH DeProspo, H Huang, CJ Penny, ... US Patent 10,229,967, 2019 | 7* | 2019 |
First Demonstration of Silicon-Like> 250 I/O Per mm Per Layer Multilayer RDL on Glass Panel Interposers by Embedded Photo-Trench and Fly Cut Planarization B DeProspo, F Liu, C Nair, A Kubo, F Wei, Y Chen, V Sundaram, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1152-1157, 2018 | 7 | 2018 |
Heterogeneous metallization using solid diffusion removal of metal interconnects BD Briggs, LA Clevenger, BH DeProspo, H Huang, CJ Penny, ... US Patent App. 15/434,335, 2018 | 7 | 2018 |
Low Cost Panel-Based 1-2 Micron RDL Technologies with Lower Resistance than Si BEOL for Large Packages F Liu, H Ito, R Zhang, BH DeProspo, F Benthaus, H Akimaru, K Hasegawa, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 613-618, 2018 | 6 | 2018 |
Structure of implementing a directed self-assembled security pattern BD Briggs, LA Clevenger, BH DeProspo, M Rizzolo US Patent 10,752,039, 2020 | 5 | 2020 |