Nonconventional applications of Mueller matrix-based scatterometry for advanced technology nodes D Dixit, N Keller, Y Lifshitz, T Kagalwala, A Elia, V Todi, J Fronheiser, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 17 (3), 034001-034001, 2018 | 22 | 2018 |
Sensitivity analysis and line edge roughness determination of 28-nm pitch silicon fins using Mueller matrix spectroscopic ellipsometry-based optical critical dimension metrology D Dixit, S O’Mullane, S Sunkoju, A Gottipati, ER Hosler, V Kamineni, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 14 (3), 031208-031208, 2015 | 22 | 2015 |
Optical critical dimension metrology for directed self-assembly assisted contact hole shrink D Dixit, A Green, ER Hosler, V Kamineni, ME Preil, N Keller, J Race, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 15 (1), 014004, 2016 | 20 | 2016 |
Metrology for block copolymer directed self-assembly structures using Mueller matrix-based scatterometry DJ Dixit, V Kamineni, R Farrell, ER Hosler, M Preil, J Race, B Peterson, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 14 (2), 10, 2015 | 20 | 2015 |
Advanced applications of scatterometry based optical metrology D Dixit, N Keller, T Kagalwala, F Recchia, Y Lifshitz, A Elia, V Todi, ... Metrology, Inspection, and Process Control for Microlithography XXXI 10145 …, 2017 | 14 | 2017 |
Mueller matrix optical scatterometry of Si fins patterned using directed self-assembly block copolymer line arrays D Dixit, M Medikonda, AC Diebold, B Peterson, J Race 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014 …, 2014 | 11 | 2014 |
Spectroscopic ellipsometry studies of 3-stage deposition of CuIn1− xGaxSe2 on Mo-coated glass and stainless steel substrates S Sunkoju, S Schujman, D Dixit, A Diebold, J Li, R Collins, P Haldar Thin Solid Films 606, 113-119, 2016 | 9 | 2016 |
Metrology for directed self-assembly block lithography using optical scatterometry D Dixit, V Kamineni, R Farrell, E Hosler, M Preil, J Race, B Peterson, ... Metrology, Inspection, and Process Control for Microlithography XXVIII 9050 …, 2014 | 9 | 2014 |
Correlation study of actual temperature profile and in-line metrology measurements for within-wafer uniformity improvement and wafer edge yield enhancement F Fang, A Vaid, A Vinslava, R Casselberry, S Mishra, D Dixit, P Timoney, ... Metrology, Inspection, and Process Control for Microlithography XXXII 10585 …, 2018 | 7 | 2018 |
Advancements in ellipsometric and scatterometric analysis S O’Mullane, D Dixit, AC Diebold, Z Ma, DG Seiler Metrology and diagnostic techniques for nanoelectronics, 65-108, 2017 | 7 | 2017 |
Characterization of Overlay and Tilt in Advanced Technology Nodes using Scatterometry AV Dhairya Dixit, Sonal Dey, Taher Kagalwala, Padraig Timoney, Yudesh ... 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2019 | 6 | 2019 |
Silicon fin line edge roughness determination and sensitivity analysis by Mueller matrix spectroscopic ellipsometry based scatterometry D Dixit, S O'Mullane, S Sunkoju, ER Hosler, V Kamineni, M Preil, N Keller, ... SPIE 9424, 2015 | 4 | 2015 |
Optical metrology for directed self-assembly patterning using Mueller matrix spectroscopic ellipsometry based scatterometry DJ Dixit State University of New York at Albany, 2015 | 3 | 2015 |
Metrology manufacturing control factors: A holistic approach for supporting 14nm and 7nm D Jayez, A Vaid, E Solecky, M Lenahan, D Dixit, C Largo, G Vakas, ... 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC …, 2017 | 2 | 2017 |
Optical CD metrology for directed self-assembly assisted contact hole shrink process D Dixit, ER Hosler, M Preil, N Keller, J Race, JS Chun, M O’Sullivan, ... Metrology, Inspection, and Process Control for Microlithography XXIX 9424 …, 2015 | 2 | 2015 |
Process control of semiconductor fabrication based on linkage between different fabrication steps P Timoney, T Kagalwala, A Vaid, S Mahendrakar, D Dixit, S Yogev, ... US Patent App. 16/288,152, 2020 | | 2020 |