| Copper deposition in the presence of polyethylene glycol: I. Quartz crystal microbalance study JJ Kelly, AC West Journal of The Electrochemical Society 145 (10), 3472, 1998 | 464 | 1998 |
| Leveling and microstructural effects of additives for copper electrodeposition JJ Kelly, C Tian, AC West Journal of the Electrochemical Society 146 (7), 2540, 1999 | 365 | 1999 |
| Copper deposition in the presence of polyethylene glycol: II. Electrochemical impedance spectroscopy JJ Kelly, AC West Journal of The Electrochemical Society 145 (10), 3477, 1998 | 285 | 1998 |
| Mechanism of Co liner as enhancement layer for Cu interconnect gap-fill M He, X Zhang, T Nogami, X Lin, J Kelly, H Kim, T Spooner, D Edelstein, ... Journal of The Electrochemical Society 160 (12), D3040, 2013 | 109 | 2013 |
| Additive effects during pulsed deposition of Cu‐Co nanostructures JJ Kelly, PE Bradley, D Landolt Journal of The Electrochemical Society 147 (8), 2975, 2000 | 93 | 2000 |
| Future on-chip interconnect metallization and electromigration CK Hu, J Kelly, H Huang, K Motoyama, H Shobha, Y Ostrovski, JHC Chen, ... 2018 ieee international reliability physics symposium (irps), 4F. 1-1-4F. 1-6, 2018 | 65 | 2018 |
| FINFET technology featuring high mobility SiGe channel for 10nm and beyond D Guo, G Karve, G Tsutsui, KY Lim, R Robison, T Hook, R Vega, D Liu, ... 2016 IEEE Symposium on VLSI Technology, 1-2, 2016 | 65 | 2016 |
| Thermal stability of Ni–Mn electrodeposits AA Talin, EA Marquis, SH Goods, JJ Kelly, MK Miller Acta materialia 54 (7), 1935-1947, 2006 | 65 | 2006 |
| Metallurgy of high strength Ni–Mn microsystems fabricated by electrodeposition NYC Yang, TJ Headley, JJ Kelly, JM Hruby Scripta materialia 51 (8), 761-766, 2004 | 62 | 2004 |
| Electrodeposited nickel–manganese: an alloy for microsystem applications SH Goods, JJ Kelly, NYC Yang Microsystem Technologies 10, 498-505, 2004 | 54 | 2004 |
| Experimental study of nanoscale Co damascene BEOL interconnect structures J Kelly, JHC Chen, H Huang, CK Hu, E Liniger, R Patlolla, B Peethala, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 53 | 2016 |
| Superfilled metal contact vias for semiconductor devices JJ Kelly, VS Basker, BS Haran, SC Seo, TA Vo US Patent 8,691,687, 2014 | 51 | 2014 |
| Copper interconnect formation JJ Kelly, T Nogami, K Tsumura US Patent 8,435,887, 2013 | 51 | 2013 |
| High performance nanostructured Ni-Mn alloy for microsystem applications JJ Kelly, SH Goods, NYC Yang Electrochemical and solid-state letters 6 (6), C88, 2003 | 48 | 2003 |
| Cobalt interconnect on same copper barrier process integration at the 7nm node FW Mont, X Zhang, W Wang, JJ Kelly, TE Standaert, R Quon, ET Ryan 2017 IEEE international interconnect technology conference (IITC), 1-3, 2017 | 47 | 2017 |
| Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires CK Hu, J Kelly, JHC Chen, H Huang, Y Ostrovski, R Patlolla, B Peethala, ... 2017 IEEE International Interconnect Technology Conference (IITC), 1-3, 2017 | 44 | 2017 |
| The Nucleation Reaction on Photosensitive TiO2 Films JJ Kelly, JK Vondeling Journal of The Electrochemical Society 122 (8), 1103, 1975 | 41 | 1975 |
| CVD Co and its application to Cu damascene interconnections T Nogami, J Maniscalco, A Madan, P Flaitz, P DeHaven, C Parks, L Tai, ... 2010 IEEE International Interconnect Technology Conference, 1-3, 2010 | 40 | 2010 |
| Three-dimensional structuring of electrodeposited Cu-Co multilayer alloys JJ Kelly, M Cantoni, D Landolt Journal of The Electrochemical Society 148 (9), C620, 2001 | 40 | 2001 |
| Effect of current distribution on quartz crystal microbalance measurements JJ Kelly, KMA Rahman, CJ Durning, AC West Journal of the Electrochemical Society 145 (2), 492, 1998 | 39 | 1998 |
