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T. H. LeeProfessor of Electrical and Computer Engineering, National University of SingaporeVerified email at nus.edu.sg
Xiaocong LiSchool of Engineering and Applied Sciences, Harvard UniversityVerified email at seas.harvard.edu
Zhu HaiyueSingapore Institute of Manufacturing Technology, A*STARVerified email at SIMTech.a-star.edu.sg
Abdullah Al MamunAssoc. Prof. of Electrical & Computer Engineering, National University of SingaporeVerified email at nus.edu.sg
Masayoshi TomizukaMechaniccal Engineering, University of CaliforniaVerified email at me.berkeley.edu
Silu ChenNingbo Institute of Materials Technology and Engineering, Chinese Academy of SciencesVerified email at nimte.ac.cn
Clarence de SilvaProfessor of Mechanical Engineering, The University of British ColumbiaVerified email at mech.ubc.ca
Liang WenyuA*STAR Institute for Infocomm Research; National University of SingaporeVerified email at i2r.a-star.edu.sg
Cheng XiangNational University of SingaporeVerified email at nus.edu.sg
F.L. Lewisprofessor of electrical engineering, The University of Texas at ArlingtonVerified email at uta.edu
Vadakkepat PrahladNational University of SingaporeVerified email at nus.edu.sg
Kai ChenHKUSTVerified email at connect.hkust-gz.edu.cn
Lei ZhengPhD Candidate, HKUST; HKUST(Guangzhou)Verified email at connect.ust.hk
Shaojie ShenAssociate Professor, Hong Kong University of Science and TechnologyVerified email at ust.hk
Sam GeNational University of SingaporeVerified email at nus.edu.sg
Shengbo Eben Li(李升波)Professor at Tsinghua UniversityVerified email at tsinghua.edu.cn
Zicheng ZhuHefei University of TechnologyVerified email at mail.hfut.edu.cn
Yubin WangThe Hong Kong University of Science and TechnologyVerified email at ieee.org
Lin ZhaoAssistant Professor, National University of SingaporeVerified email at nus.edu.sg
Lei ZhuHong Kong University of Science and TechnologyVerified email at ust.hk
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Jun Ma
Assistant Professor, The Hong Kong University of Science and Technology
Verified email at ust.hk