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Li Zheng
Li Zheng
Verified email at gatech.edu
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Year
Embedded cooling technologies for densely integrated electronic systems
TE Sarvey, Y Zhang, L Zheng, P Thadesar, R Gutala, C Cheung, ...
2015 IEEE Custom Integrated Circuits Conference (CICC), 1-8, 2015
442015
Airgap interconnects: Modeling, optimization, and benchmarking for backplane, pcb, and interposer applications
V Kumar, R Sharma, E Uzunlar, L Zheng, R Bashirullah, P Kohl, MS Bakir, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (8 …, 2014
362014
Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs
L Zheng, Y Zhang, G Huang, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014
352014
3-D stacked tier-specific microfluidic cooling for heterogeneous 3-D ICs
Y Zhang, L Zheng, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013
352013
A silicon interposer platform utilizing microfluidic cooling for high-performance computing systems
L Zheng, Y Zhang, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015
222015
IEEE Trans. Elec. Dev.
JF Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir
IEEE Trans. Elec. Dev 63, 2510-2516, 2016
202016
Full-chip power supply noise time-domain numerical modeling and analysis for single and stacked ICs
L Zheng, Y Zhang, MS Bakir
IEEE transactions on electron devices 63 (3), 1225-1231, 2016
202016
Silicon interposer with embedded microfluidic cooling for high-performance computing systems
L Zheng, Y Zhang, X Zhang, MS Bakir
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 828-832, 2015
142015
Design, fabrication and assembly of a novel electrical and microfluidic I/Os for 3-D chip stack and silicon interposer
L Zheng, Y Zhang, MS Bakir
2013 IEEE 63rd Electronic Components and Technology Conference, 2243-2248, 2013
122013
Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling
PA Thadesar, L Zheng, MS Bakir
2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014
112014
Impact of on-chip interconnect on the performance of 3-D integrated circuits with through-silicon vias: Part II
X Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir
IEEE Transactions on Electron Devices 63 (6), 2510-2516, 2016
102016
Chip-to-chip interconnect integration technologies
M Zia, C Zhang, HS Yang, L Zheng, M Bakir
IEICE Electronics Express 13 (6), 20162001-20162001, 2016
102016
Fabrication and characterization of electrical interconnects and microfluidic cooling for 3D ICS with silicon interposer
H Oh, Y Zhang, L Zheng, GS May, MS Bakir
Heat Transfer Engineering 37 (11), 903-911, 2016
82016
Impact of on-chip interconnect on the performance of 3-D integrated circuits with through silicon vias: Part i
V Kumar, H Oh, X Zhang, L Zheng, MS Bakir, A Naeemi
IEEE Transactions on Electron Devices 63 (6), 2503-2509, 2016
82016
A simulation tool for rapid investigation of trends in 3-DIC performance and power consumption
W Wahby, L Zheng, Y Zhang, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016
72016
Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge
HS Yang, C Zhang, M Zia, L Zheng, MS Bakir
2014 Optical Interconnects Conference, 71-72, 2014
62014
Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer
L Zheng, MS Bakir
2012 IEEE International SOC Conference, 159-164, 2012
62012
Electrical interconnect and microfluidic cooling within 3D ICs and silicon interposer
H Oh, Y Zhang, L Zheng, MS Bakir
International Conference on Nanochannels, Microchannels, and Minichannels …, 2014
32014
Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation
Y Zhang, L Zheng, MS Bakir
2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013
32013
Compact modeling and optimization of fine-pitch interconnects for silicon interposers
V Kumar, L Zheng, M Bakir, A Naeemi
2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013
32013
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Articles 1–20