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Co-authors
- Behzad RazaviProfessor of Electrical Engineering, UCLAVerified email at ee.ucla.edu
- Sai SanjeetPhD Student, Electrical Engineering, University at BuffaloVerified email at buffalo.edu
- Keshab K. ParhiUniversity of Minnesota, Erwin A. Kelen Chair in Electrical EngineeringVerified email at umn.edu
- Masahiro FujitaUniversity of TokyoVerified email at ee.t.u-tokyo.ac.jp
- rahul thottathilMicrochip Technology Inc.Verified email at microchip.com
- Nevin Alex Jacob📚Verified email at intel.com
- Shruti KonwarPh.D., Dept. of E&ECE, IIT KharagpurVerified email at iitkgp.ac.in
- Denis AmparoVerified email at amparo.net
- Jie RenShanghai Institute of Microsystem and Information Technology (SIMIT), Chinese Academy of SciencesVerified email at mail.sim.ac.cn
- Sesha Sairam RegulagaddaIndian Institute of Technology (IIT) HyderabadVerified email at iith.ac.in
- Vikas ChoudharyAnalog DevicesVerified email at analog.com
- Shiuh-hua Wood ChiangBrigham Young UniversityVerified email at byu.edu
- Romesh NandwanaTechnical Leader, Cisco SystemsVerified email at illinois.edu
- Guanghua ShuOracle LabsVerified email at illinois.edu
- Nagesh PatlePhD Student, University of California, BerkeleyVerified email at berkeley.edu
- Veeresh Babu VulligaddalaSenior Manager, ams semiconductors India Pvt Ltd.Verified email at ams-osram.com
- Shouharda GhoshPhD Scholar at IIT GandhinagarVerified email at iitgn.ac.in
- HARSHIT ROYGoogle India; Indian Institute of Technology, KharagpurVerified email at google.com
- Senorita DebPhD Scholar, IIT KharagpurVerified email at iitkgp.ac.in
- Ahmed ElkholyUniversity of IllinoisVerified email at illinois.edu