‪Keyu Wang‬ - ‪Google Scholar‬

Get my own profile

Cited by

	All	Since 2019
Citations	56	56
h-index	2	2
i10-index	2	2

0

28

14

2022202320242 26 28

Public access

1 article

0 articles

available

not available

Based on funding mandates

Co-authors

Tiwei WeiAssistant Professor at Purdue University, Postdoc at Stanford University, Ph.D. in IMEC/KU LeuvenVerified email at stanford.edu
Shuhang LyuSchool of Mechanical Engineering, Purdue UniversityVerified email at purdue.edu

Keyu Wang

Keyu Wang

Ph.D. student at Purdue University

Verified email at purdue.edu - Homepage

Semiconductor interconnects Advanced packaging Packaging reliability


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Dynamic electrochromism for all-season radiative thermoregulation C Sui, J Pu, TH Chen, J Liang, YT Lai, Y Rao, R Wu, Y Han, K Wang, X Li, ... Nature Sustainability 6 (4), 428-437, 2023	46	2023
Bio‐Inspired Computational Design of Vascularized Electrodes for High‐Performance Fast‐Charging Batteries Optimized by Deep Learning C Sui, YY Li, X Li, G Higueros, K Wang, W Xie, PC Hsu Advanced Energy Materials 12 (6), 2103044, 2022	10	2022
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling S Lyu, Q Wu, Z Gong, K Wang, KE Goodson, T Wei IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024		2024

The system can't perform the operation now. Try again later.

Articles 1–3