| In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration PI Dietrich, M Blaicher, I Reuter, M Billah, T Hoose, A Hofmann, C Caer, ... Nature Photonics 12 (4), 241-247, 2018 | 339 | 2018 |
| Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding MR Billah, M Blaicher, T Hoose, PI Dietrich, P Marin-Palomo, ... Optica 5 (7), 876-883, 2018 | 215 | 2018 |
| Connecting silicon photonic circuits to multicore fibers by photonic wire bonding N Lindenmann, S Dottermusch, ML Goedecke, T Hoose, MR Billah, ... Journal of lightwave Technology 33 (4), 755-760, 2015 | 149 | 2015 |
| Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography M Blaicher, MR Billah, J Kemal, T Hoose, P Marin-Palomo, A Hofmann, ... Light: Science & Applications 9 (1), 71, 2020 | 116 | 2020 |
| Multi-chip integration of lasers and silicon photonics by photonic wire bonding M Billah, T Hoose, T Onanuga, N Lindenmann, P Dietrich, T Wingert, ... CLEO: Science and Innovations, STu2F. 2, 2015 | 27 | 2015 |
| Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements Y Xu, P Maier, M Blaicher, PI Dietrich, P Marin-Palomo, W Hartmann, ... Scientific reports 11 (1), 16426, 2021 | 25 | 2021 |
| 3D-printed optical probes for wafer-level testing of photonic integrated circuits M Trappen, M Blaicher, PI Dietrich, C Dankwart, Y Xu, T Hoose, MR Billah, ... Optics Express 28 (25), 37996-38007, 2020 | 24 | 2020 |
| 8-channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding MR Billah, M Blaicher, JN Kemal, T Hoose, H Zwickel, PI Dietrich, ... Optical Fiber Communication Conference, Th5D. 6, 2017 | 23 | 2017 |
| Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips T Hoose, M Billah, M Blaicher, P Marin, PI Dietrich, A Hofmann, ... Optical Fiber Communication Conference, M2I. 7, 2016 | 19 | 2016 |
| 1. Bringing Accuracy to Open Virtual Platforms (OVP): A Safari from High-Level Tools to Low-Level Microarchitectures GSP Delicia, T Bruckschloegl, P Figuli, C Tradowsky, GM Almeida, ... Opt. Express 26, 220-232, 2018 | 17 | 2018 |
| Lenses for low-loss chip-to-fiber and fiber-to-fiber coupling fabricated by 3D direct-write lithography PI Dietrich, I Reuter, M Blaicher, S Schneider, M Billah, T Hoose, ... CLEO: Science and Innovations, SM1G. 4, 2016 | 17 | 2016 |
| 3D-printed ultra-broadband highly efficient out-of-plane coupler for photonic integrated circuits M Blaicher, MR Billah, T Hoose, PI Dietrich, A Hofmann, S Randel, ... CLEO: Science and Innovations, STh1A. 1, 2018 | 16 | 2018 |
| Four-channel 784 Gbit/s transmitter module enabled by photonic wire bonding and silicon-organic hybrid modulators MR Billah, JN Kemal, P Marin-Palomo, M Blaicher, Y Kutuvantavida, ... 2017 European Conference on Optical Communication (ECOC), 1-3, 2017 | 9 | 2017 |
| 3D-printed optics for wafer-scale probing M Trappen, M Blaicher, PI Dietrich, T Hoose, Y Xu, MR Billah, W Freude, ... 2018 European Conference on Optical Communication (ECOC), 1-3, 2018 | 7 | 2018 |
| Hardwired configurable photonic integrated circuits enabled by 3D nanoprinting T Hoose, M Blaicher, JN Kemal, H Zwickel, MR Billah, PI Dietrich, ... 2018 European Conference on Optical Communication (ECOC), 1-3, 2018 | 6 | 2018 |
| InP/silicon hybrid external-cavity lasers (ECL) using photonic wirebonds as coupling elements Y Xu, P Maier, M Blaicher, PI Dietrich, P Marin-Palomo, W Hartmann, ... Optical Fiber Communication Conference, M4H. 6, 2020 | 5 | 2020 |
| Four-in-one interferometer for coherent and self-coherent detection J Li, MR Billah, PC Schindler, M Lauermann, S Schuele, S Hengsbach, ... Optics express 21 (11), 13293-13304, 2013 | 5 | 2013 |
| Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration C Koos, W Freude, N Lindenmann, S Koeber, T Hoose, MR Billah Laser 3D Manufacturing 8970, 31-40, 2014 | 2 | 2014 |
| Hybrid photonic multi-chip integration enabled by 3D nano-printing C Koos, W Freude, S Randel, M Billah, M Blaicher, T Hoose, PI Dietrich, ... 2017 IEEE Photonics Conference (IPC) Part II, 1-2, 2017 | 1 | 2017 |
| Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform C Koos, W Freude, J Leuthold, M Kohl, LR Dalton, W Bogaerts, ... 2015 IEEE Photonics Conference (IPC), 480-481, 2015 | 1 | 2015 |
Christian KoosProfessor of Photonics, Karlsruhe Institute of TechnologyEmail yang diverifikasi di kit.edu
