| Computational fluid dynamics modelling of human upper airway: A review WM Faizal, NNN Ghazali, CY Khor, IA Badruddin, MZ Zainon, AA Yazid, ... Computer methods and programs in biomedicine 196, 105627, 2020 | 76 | 2020 |
| Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding CY Khor, ZM Ariff, FC Ani, MA Mujeebu, MK Abdullah, MZ Abdullah, ... International Communications in Heat and Mass Transfer 37 (2), 131-139, 2010 | 75 | 2010 |
| Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0 Ag–0.5 Cu solder pastes on microstructure and mechanical properties after reflow soldering process S Chellvarajoo, MZ Abdullah, CY Khor Materials & Design 82, 206-215, 2015 | 61 | 2015 |
| Numerical and experimental investigations on effect of fan height on the performance of piezoelectric fan in microelectronic cooling MK Abdullah, MZ Abdullah, MV Ramana, CY Khor, KA Ahmad, ... International Communications in Heat and Mass Transfer 36 (1), 51-58, 2009 | 57 | 2009 |
| CFD modeling of pin shape effects on capillary flow during wave soldering MSA Aziz, MZ Abdullah, CY Khor, A Jalar, FC Ani International Journal of Heat and Mass Transfer 72, 400-410, 2014 | 56 | 2014 |
| Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review CS Lau, CY Khor, D Soares, JC Teixeira, MZ Abdullah Soldering & Surface Mount Technology 28 (2), 41-62, 2016 | 51 | 2016 |
| Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan AM Najib, MZ Abdullah, CY Khor, AA Saad International Journal of Heat and Mass Transfer 87, 49-58, 2015 | 50 | 2015 |
| Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach MSA Aziz, MZ Abdullah, CY Khor, FC Ani International Communications in Heat and Mass Transfer 48, 116-123, 2013 | 50 | 2013 |
| FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process CY Khor, MZ Abdullah, MA Mujeebu, FC Ani International Communications in Heat and Mass Transfer 37 (3), 281-286, 2010 | 50 | 2010 |
| Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process CY Khor, MA Mujeebu, MZ Abdullah, FC Ani Microelectronics Reliability 50 (1), 98-105, 2010 | 47 | 2010 |
| Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method CS Lau, MZ Abdullah, CY Khor Microelectronics International 30 (3), 151-168, 2013 | 46 | 2013 |
| Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering MSA Aziz, MZ Abdullah, CY Khor, ZM Fairuz, AM Iqbal, M Mazlan, ... Advances in Mechanical Engineering 6, 275735, 2014 | 44 | 2014 |
| Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology CY Khor, MZ Abdullah Simulation modelling practice and theory 29, 109-122, 2012 | 41 | 2012 |
| Fluid/structure interaction analysis of the effects of solder bump shapes and input/output counts on moulded packaging CY Khor, MZ Abdullah, WC Leong IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (4 …, 2011 | 41 | 2011 |
| Investigation of the fluid/structure interaction phenomenon in IC packaging CY Khor, MZ Abdullah, HJT Tan, WC Leong, D Ramdan Microelectronics Reliability 52 (1), 241-252, 2012 | 40 | 2012 |
| Application of flexible printed circuit board (FPCB) in personal computer motherboards: focusing on mechanical performance WC Leong, MZ Abdullah, CY Khor Microelectronics Reliability 52 (4), 744-756, 2012 | 38 | 2012 |
| Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process CY Khor, MZ Abdullah, MK Abdullah, MA Mujeebu, D Ramdan, M Majid, ... International Journal of Heat and Mass Transfer 54 (9-10), 1861-1870, 2011 | 38 | 2011 |
| Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation EES Ong, MZ Abdullah, CY Khor, WK Loh, CK Ooi, R Chan Microelectronic Engineering 113, 40-49, 2014 | 36 | 2014 |
| SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ... Soldering & Surface Mount Technology 30 (1), 1-13, 2018 | 35 | 2018 |
| Influence of solder bump arrangements on molded IC encapsulation CY Khor, MZ Abdullah, CS Lau, WC Leong, MSA Aziz Microelectronics reliability 54 (4), 796-807, 2014 | 35 | 2014 |
Mohd Zulkfly AbdullahUniversiti Sains MalaysiaVerified email at eng.usm.my
