| Thermal challenges in next generation electronic systems-summary of panel presentations and discussions SV Garimella, YK Joshi, A Bar-Cohen, R Mahajan, KC Toh, VP Carey, ... IEEE Transactions on Components and Packaging Technologies 25 (4), 569-575, 2002 | 104 | 2002 |
| Assessing good-practice frameworks for the development of sustainable energy communities in Europe: Lessons from Denmark and Ireland E Heaslip, GJ Costello, J Lohan Journal of Sustainable Development of Energy, Water and Environment Systems …, 2016 | 58 | 2016 |
| A benchmark study of computational fluid dynamics predictive accuracy for component-printed circuit board heat transfer V Eveloy, J Lohan, P Rodgers IEEE transactions on components and packaging technologies 23 (3), 568-577, 2000 | 51 | 2000 |
| Experimental and numerical investigation into the influence of printed circuit board construction on component operating temperature in natural convection J Lohan, P Tiilikka, P Rodgers, CM Fager, J Rantala IEEE Transactions on Components and Packaging Technologies 23 (3), 578-586, 2000 | 39 | 2000 |
| Experimental validation of numerical heat transfer predictions for singleand multi-component printed circuit boards in natural convection environments P Rodgers, V Eveloy, J Lohan, CM Fager, P Tiilikka, J Rantala Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 1999 | 39 | 1999 |
| Transient thermal behaviour of a board-mounted 160-lead plastic quad flat pack J Lohan, M Davies Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in …, 1994 | 36 | 1994 |
| Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection J Lohan, P Tiilikka, P Rodgers, CM Fager, J Rantala ITHERM 2000. The Seventh Intersociety Conference on Thermal and …, 2000 | 28 | 2000 |
| Validating numerical predictions of component thermal interaction on electronic printed circuit boards in forced convection air flows by experimental analysis P Rodgers, J Lohan, V Eveloy, CM Fager, J Rantala Advances in electronic packaging 1, 999-1009, 1999 | 28 | 1999 |
| Factors affecting the operational thermal resistance of electronic components MRD Davies, R Cole, J Lohan J. Electron. Packag. 122 (3), 185-191, 2000 | 24 | 2000 |
| Visualization of forced air flows over a populated printed circuit board and their impact on convective heat transfer J Lohan, V Eveloy, P Rodgers ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002 | 23 | 2002 |
| Validation and application of different experimental techniques to measure electronic component operating junction temperature J Lohan, P Rodgers, CM Fager, R Lehtiniemi, V Eveloy, P Tulikka, ... IEEE Transactions on Components and Packaging Technologies 22 (2), 252-258, 1999 | 22 | 1999 |
| Thermal interaction between electronic components JM Lohan, MRD Davies American Society of Mechanical Engineers, New York, NY (United States), 1996 | 22 | 1996 |
| Comparison of metaheuristic optimisation methods for grid-edge technology that leverages heat pumps and thermal energy storage C Schellenberg, J Lohan, L Dimache Renewable and Sustainable Energy Reviews 131, 109966, 2020 | 19 | 2020 |
| The thermal characteristics of a board-mounted 160 lead plastic quad flat pack. M Davies, J Lohan, J Punch, T Moore Thermal Management of Electronic Systems: Proceedings of EUROTHERM Seminar …, 1994 | 17 | 1994 |
| Operational optimisation of a heat pump system with sensible thermal energy storage using genetic algorithm C Schellenberg, J Lohan, L Dimache Thermal Science 22 (5), 2189-2202, 2018 | 16 | 2018 |
| Effect of both PCB thermal conductivity and nature of forced convection environment on component operating temperature: Experimental measurement and numerical prediction J Lohan, P Tiilikka, CM Fager, J Rantala Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2000 | 16 | 2000 |
| Effect of PCB thermal conductivity on the operating temperature of an SO-8 package in a natural convection environment: Experimental measurement versus numerical prediction J Lohan, P Tiilikka, P Rodgers, C Fager, J Rantala International Workshop on Thermal Investigations of ICs and Microstructures …, 1999 | 13 | 1999 |
| Thermal superposition on a populated printed circuit board J Lohan, M Davies, R Cole ASME-PUBLICATIONS-HTD 343, 73-82, 1997 | 13 | 1997 |
| Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component V Eveloy, P Rodgers, J Lohan ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002 | 11 | 2002 |
| An investigation into the thermal interaction between electronic components on a printed circuit board JM Lohan University of Limerick, 1995 | 11 | 1995 |
