| Electrical characterization of high performance fine pitch interconnects in silicon-interconnect fabric SC Jangam, AA Bajwa, KK Thankkappan, P Kittur, SS Iyer 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1283-1288, 2018 | 45 | 2018 |
| Deep trench capacitors in silicon interconnect fabric KT Kannan, SS Iyer 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2295-2301, 2020 | 12 | 2020 |
| On-chip ESD monitor KT Kannan, B Vaisband, SS Iyer 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2225-2233, 2019 | 2 | 2019 |
| An On-Chip ESD Sensor for Use in Advanced Packaging KT Kannan, B Vaisband, K Sahoo, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 1 | 2022 |
| Characterization of Fine-Pitch Interconnections (≤ 10 μm) on Silicon Interconnect Fabric for Heterogeneous Integration SC Jangam, A Bajwa, KK Thankappan, SS Iyer International Symposium on Microelectronics 2018 (1), 000556-000560, 2018 | 1 | 2018 |
| On-chip electrostatic discharge sensor S Iyer, KK Thankappan, B Vaisband US Patent App. 17/332,931, 2022 | | 2022 |
| Novel high-power delivery architecture for heterogeneous Integration systems KT Kannan, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 164-169, 2021 | | 2021 |
| An On-chip ESD Sensor for Use in Advanced Packaging KK Thankappan University of California, Los Angeles, 2021 | | 2021 |
| Reliability Evaluation of Silicon Interconnect Fabric Technology KK Thankappan, A Bajwa, B Vaisband, SC Jangam, SS Iyer 2019 IEEE International Reliability Physics Symposium (IRPS), 1-5, 2019 | | 2019 |
SUBRAMANIAN S. IYERUniversity of California at Los Angeles,Verified email at g.ucla.edu
