Get my own profile
Public access
View all7 articles
2 articles
available
not available
Based on funding mandates
Co-authors
- Rohit SharmaPenn State UniversityVerified email at psu.edu
- Sourajeet RoyAssociate Professor, IIT RoorkeeVerified email at iitr.ac.in
- Brajesh Kumar KaushikProfessor of Electronics and Communication Engg., IIT-RoorkeeVerified email at iitr.ac.in
- Surila GuglaniIndian Institute of Technology RoorkeeVerified email at ec.iitr.ac.in
- Dr. Manodipan SahooAssistant Professor, Department of ECE, IIT(ISM), DhanbadVerified email at iitism.ac.in
- Bhawana KumariSenior Research FellowVerified email at ece.ism.ac.in
- Madhavan SwaminathanDept Head EE; William E. Leonhard Endowed Chair; Director CHIMES (an SRC JUMP 2.0 Center) Penn StateVerified email at psu.edu
- Suyash KushwahaPhD Candidate, Electrical Engineering Department, VLSI Group, IIT Ropar.Verified email at iitrpr.ac.in
- Sherin A ThomasPh.D. scholar at IIT RoparVerified email at iitrpr.ac.in
- Devarshi Mrinal DasAssistant Professor, Indian Institute of Technology RoparVerified email at iitrpr.ac.in
- Felipe TrevisoPolitecnico di TorinoVerified email at polito.it
- Riccardo TrincheroAssociate Professor, Politecnico di Torino, DETVerified email at polito.it
- Flavio CanaveroPolitecnico di TorinoVerified email at polito.it
- Nastaran SoleimaniPh.D Student of Politecnico di TorinoVerified email at studenti.polito.it
- Dr. Vijay Rao KumbhareKoneru Lakshmaiah Education Foundation, HyderabadVerified email at iiitnr.edu.in
- Punya Prasanna PaltaniAssistant Professor, International Institute of Information Technology, Naya RaipurVerified email at iiitnr.edu.in
- Dr. Manoj Kumar Majumder, SMIEEEIIIT Naya RaipurVerified email at iiitnr.edu.in
- Nikita AmbasanaSilicon Packaging Engineer, Intel IndiaVerified email at intel.com
- Osama Waqar BhattiAppleVerified email at apple.com