| Adhesive bond-line degradation detection via a cross-correlation electromechanical impedance–based approach R Dugnani, Y Zhuang, F Kopsaftopoulos, FK Chang Structural Health Monitoring 15 (6), 650-667, 2016 | 65 | 2016 |
| Integrity monitoring of adhesively bonded joints via an electromechanical impedance-based approach Y Zhuang, F Kopsaftopoulos, R Dugnani, FK Chang Structural Health Monitoring 17 (5), 1031-1045, 2018 | 55 | 2018 |
| Bondline integrity monitoring of adhesively bonded structures via an electromechanical impedance based approach Y Zhuang, F Kopsaftopoulos, FK Chang Proceedings of the 10th international workshop on structural health …, 2015 | 22 | 2015 |
| A self-diagnostic adhesive for monitoring bonded joints in aerospace structures Y Zhuang, Y Li, F Kopsaftopoulos, FK Chang Sensors and Smart Structures Technologies for Civil, Mechanical, and …, 2016 | 14 | 2016 |
| Static tactile sensing for a robotic electronic skin via an electromechanical impedance-based approach C Liu, Y Zhuang, A Nasrollahi, L Lu, MF Haider, FK Chang Sensors 20 (10), 2830, 2020 | 13 | 2020 |
| Design of Smart Adhesive Films for Bondline Integrity Monitoring Y Zhuang, F Kopsaftopoulos, YH Li, FK Chang Feb, 2012 | 2 | 2012 |
| Self Diagnostic Adhesive for Bonded Joints in Aircraft Structures FK Chang, Leland Stanford Junior Univ CA Stanford United States Leland Stanford Junior Univ CA Stanford United States, 2016 | 1 | 2016 |
| Monitoring Bondline Integrity Via Embedded Piezoelectric Sensors Y Zhuang Stanford University, 2018 | | 2018 |
| Bondline Degradation Monitoring and Remaining Strength Estimation via an Electromechanical Impedance-Based Method Y ZHUANG, F KOPSAFTOPOULOS, FUKUO CHANG 1st International Workshop on Structural Health Monitoring for Railway System, 2016 | | 2016 |
| Rapidly Manufacturable Robot Y Zhuang, R Lacroix, S Kuplic, A Bharath | | 2009 |
Fotis KopsaftopoulosAssistant Professor, Rensselaer Polytechnic InstituteVerified email at rpi.edu
