| Thermo-mechanical challenges in stacked packaging D Agonafer, A Kaisare, MM Hossain, Y Lee, BP Dewan-Sandur, ... Heat Transfer Engineering 29 (2), 134-148, 2008 | 35 | 2008 |
| Numerical analysis of partial admission flow in an industrial steam turbine TJ Kalkkuhl, D Engelmann, U Harbecke, R Mailach Turbo Expo: Power for Land, Sea, and Air 44724, 443-453, 2012 | 28* | 2012 |
| Thermal based optimization of functional block distributions in a non-uniformly powered die A Kaisare, D Agonafer, A Haji-Sheikh, G Chrysler, R Mahajan International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005 | 19 | 2005 |
| A parametric study of a typical high power LED package to enhance overall thermal performance A Vipradas, A Takawale, S Tripathi, V Swakul, A Kaisare, S Tonapi 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 15 | 2012 |
| Thermal management of die stacking architecture that includes memory and logic processor BP Dewan-Sandur, A Kaisare, D Agonafer, D Agonafer, C Amon, S Pekin, ... 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 15 | 2006 |
| Optimal thermal characterization of a stacked die package with TSV technology S Nakanekar, A Kaisare, S Tonapi 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 13 | 2012 |
| Design rule for minimizing thermal resistance in a non~ uniformly powered microprocessor A Kaisare, D Agonafer, A Haji-shiekh, G Chrysler, R Mahajan Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management …, 2006 | 12 | 2006 |
| Design for stackability of flash memory devices based on thermal optimization R Akhter, BPD Sandur, M Hossain, A Kaisare, D Agonafer, K Lawrence, ... 24th Digital Avionics Systems Conference 2, 14 pp. Vol. 2, 2005 | 9 | 2005 |
| Multi-Objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors U Raju, A Kaisare, D Agonafer, A Haji-Sheikh, G Chrysler, R Mahajan 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 7 | 2008 |
| Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package A Kaisare, Z Han, D Agonager, K Ramakrishna ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002 | 7 | 2002 |
| Thermal comparison of die stacking architectures for flash memory applications R Akhter, BPD Sandur, MM Hossain, A Kaisare, K Lawrence Proceedings of IMECE, 2005 | 6 | 2005 |
| Design for reliability of stacked die package using TSV technology S Thakur, S Nakanekar, A Kaisare, S Tonapi International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 5 | 2011 |
| Thermo-mechanical analysis of a typical solar module: A parametric study S Thakur, A Kaisare, S Tonapi 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 4 | 2012 |
| Thermal characterization of solar module due to impact of solar heat flux as an effect of geographical topology N Trifale, A Kaisare, S Tonapi 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 2 | 2012 |
| Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die A Kaisare, D Agonafer, A Haji-Sheikh, G Chrysler, R Mahajan ASME International Mechanical Engineering Congress and Exposition 47861, 43-49, 2006 | 1 | 2006 |
| An analytical and numerical model for design of non-uniformly powered silicon chips based on both thermal and device clock performance AD Kaisare The University of Texas at Arlington, 2007 | | 2007 |
| Effect of Heat Sink Assembly on Mechanical Reliability of a Wire Bonded Plastic Ball Grid Array Package A Trivedi, A Kaisare, D Agonafer, G Refai-Ahmed International Electronic Packaging Technical Conference and Exhibition 42789 …, 2007 | | 2007 |
| IMECE2006-13436 Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die A Kaisare, D Agonafer, A Haji-Sheikh, G Chrysler, R Mahajan ASME-PUBLICATIONS-HTD 377 (3), 43, 2006 | | 2006 |
| A 3-dimensional thermo-mechanical analysis of a ball grid array package AD Kaisare The University of Texas at Arlington, 2002 | | 2002 |
| Thermo-Mechanical Challenges of Stacked Packages A Kaisare | | |
