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Benard Kipsang
Benard Kipsang
Silesian University of Technology-Poland
Verified email at polsl.pl
Title
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Year
Wetting mechanism of Cu3Ni, Cu3Zn, Cu3Sn on diamond surface: A first-principles calculation
L Huang, J Yu, B Kipsang, Y Hai
Physica B: Condensed Matter 613, 412993, 2021
92021
Surface modification mechanism of SiC particles using KH5X0 (X= 5, 6, 7, 8, 9) silane coupling agents: First principle study
J Yu, L Huang, B Kipsang, Y Hai
Ceramics International 47 (18), 25551-25557, 2021
62021
Fabrication, Characterization and Deformation Behavior of a New Acrylate Copolymer-based Nonwoven Structure
DN Githinji, JT Githaiga, DR Tuigong, DS Madara, B Kipsang, S Khasindu
Chemistry and Material Research 7 (7), 11-19, 2015
22015
Reducing the cost of tea production through employing usage based preventive maintenance (Case study in Kenya tea development agency factory KTDA Chebut)
K Evans, B Kipsang
Proceedings of the The 10th International Conference on Through-Life …, 2021
2021
INVESTIGATION OF ADIPOSE MECHANICAL PROPERTIES UNDER COMPRESSION LOADING FOR IMPROVING HUMAN BODY ARMOR MODELING
WC RUTTO, B KIPSANG
Adipose Mechanical Properties Under Compression Loading for Improving Human Body Armor Modeling
K Benard, WC Rutto
Available at SSRN 4119512, 0
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