| Experimental investigation on the heat transfer performance of a PCM based pin fin heat sink with discrete heating R Srikanth, C Balaji International Journal of Thermal Sciences 111, 188-203, 2017 | 99 | 2017 |
| Multi-objective geometric optimization of a PCM based matrix type composite heat sink R Srikanth, P Nemani, C Balaji Applied energy 156, 703-714, 2015 | 88 | 2015 |
| Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions Y Hadad, B Ramakrishnan, R Pejman, S Rangarajan, PR Chiarot, ... Applied Thermal Engineering 150, 720-737, 2019 | 65 | 2019 |
| Hybrid microchannel/multi-jet two-phase heat sink: A benchmark and geometry optimization study of commercial product CH Hoang, S Rangarajan, S Khalili, B Ramakrisnan, V Radmard, ... International Journal of Heat and Mass Transfer 169, 120920, 2021 | 45 | 2021 |
| Multi-objective optimization of a chip-attached micro pin fin liquid cooling system V Radmard, Y Hadad, S Rangarajan, CH Hoang, N Fallahtafti, CL Arvin, ... Applied Thermal Engineering 195, 117187, 2021 | 41 | 2021 |
| Performance analysis and shape optimization of a water-cooled impingement micro-channel heat sink including manifolds Y Hadad, S Rangararajan, K Nemati, B Ramakrishnann, R Pejman, ... International Journal of Thermal Sciences 148, 106145, 2020 | 33 | 2020 |
| Experimental and numerical studies on heat transfer from a PCM based heat sink with baffles R Akula, A Gopinath, S Rangarajan, C Balaji International Journal of Thermal Sciences 159, 106525, 2021 | 32 | 2021 |
| Multi objective geometric optimization of phase change material based cylindrical heat sinks with internal stem and radial fins S Sridharan, R Srikanth, C Balaji Thermal Science and Engineering Progress 5, 238-251, 2018 | 31 | 2018 |
| Multi-objective optimization of 3D printed liquid cooled heat sink with guide vanes for targeting hotspots in high heat flux electronics AR Gharaibeh, MI Tradat, S Rangarajan, BG Sammakia, HA Alissa International Journal of Heat and Mass Transfer 184, 122287, 2022 | 30 | 2022 |
| A review of recent developments in pumped two-phase cooling technologies for electronic devices CH Hoang, S Rangarajan, Y Manaserh, M Tradat, G Mohsenian, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 30 | 2021 |
| An experimental apparatus for two-phase cooling of high heat flux application using an impinging cold plate and dielectric coolant CH Hoang, S Khalili, B Ramakrisnan, S Rangarajan, Y Hadad, ... 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2020 | 24 | 2020 |
| Impact of fin geometry and surface roughness on performance of an impingement two-phase cooling heat sink CH Hoang, N Fallahtafti, S Rangarajan, A Gharaibeh, Y Hadad, C Arvin, ... Applied Thermal Engineering 198, 117453, 2021 | 21 | 2021 |
| Minimizing the effects of on-chip hotspots using multi-objective optimization of flow distribution in water-cooled parallel microchannel heatsinks Y Hadad, V Radmard, S Rangarajan, M Farahikia, G Refai-Ahmed, ... Journal of Electronic Packaging 143 (2), 021007, 2021 | 21 | 2021 |
| Direct micro-pin jet impingement cooling for high heat flux applications V Radmard, Y Hadad, A Azizi, S Rangarajan, CH Hoang, C Arvin, K Sikka, ... 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2020 | 18 | 2020 |
| Effect of phase change and ambient temperatures on the thermal performance of a solid-liquid phase change material based heat sinks GK Marri, R Srikanth, C Balaji Journal of Energy Storage 30, 101327, 2020 | 16 | 2020 |
| Experimental characterization of two-phase cold plates intended for high-density data center servers using a dielectric fluid B Ramakrishnan, CH Hoang, S Khalili, Y Hadad, S Rangarajan, ... Journal of Electronic Packaging 143 (2), 020904, 2021 | 14 | 2021 |
| Liquid cooling utilizing a hybrid microchannel/multi-jet heat sink: A component level study of commercial product CH Hoang, M Tradat, Y Manaserh, B Ramakrisnan, S Rangarajan, ... International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 13 | 2020 |
| Shape optimization of hotspot targeted micro pin fins for heterogeneous integration applications N Fallahtafti, S Rangarajan, Y Hadad, C Arvin, K Sikka, CH Hoang, ... International Journal of Heat and Mass Transfer 192, 122897, 2022 | 12 | 2022 |
| Performance Analysis of Impinging Chip-Attached Micro Pin Fin Direct Liquid Cooling Package for Hotspot Targeted Applications V Radmard, A Azizi, S Rangarajan, N Fallahtafti, CH Hoang, ... 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 12 | 2021 |
| Heat transfer correlations for a composite PCM based 72 pin fin heat sink with discrete heating at the base R Srikanth, C Balaji INAE Letters 2, 65-71, 2017 | 11 | 2017 |
Bahgat G SammakiaBinghamton UniversityVerified email at binghamton.edu
