| Extreme cold-temperature high-strain rate properties of SAC solder alloys P Lall, V Yadav, V Mehta, J Suhling, K Blecker 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 782-792, 2020 | 25 | 2020 |
| Effect of 100° C Aging for Periods of up to 120-days on High Strain Rate Properties of SAC305 Alloys P Lall, V Mehta, J Suhling, K Blecker 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 19 | 2020 |
| High strain rate mechanical properties of SAC-q solder for extreme temperatures after exposure to isothermal aging up to 90 days P Lall, V Mehta, J Suhling, K Blecker Journal of Electronic Packaging 144 (2), 021108, 2022 | 17 | 2022 |
| High Strain-Rate Properties for SAC305 at Cold Operating Temperatures down to-65° C P Lall, V Mehta, J Suhling, K Blecker 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 17 | 2020 |
| High strain rate mechanical properties of SAC-Q with sustained elevated temperature storage at 100° C P Lall, V Mehta, J Suhling, D Locker Journal of Electronic Packaging 142 (4), 041104, 2020 | 15 | 2020 |
| High temperature high strain rate properties of SAC305 with effect of 100° C storage for prolonged duration P Lall, V Mehta, J Suhling, K Blecker 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 11 | 2021 |
| High Strain Rate Mechanical Properties of SAC-Q Between-65° C and+ 200° C After Exposure to Isothermal Aging P Lall, V Mehta, J Suhling, K Blecker International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 11 | 2020 |
| Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature P Lall, V Yadav, V Mehta, J Suhling, D Locker 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 830-841, 2021 | 10 | 2021 |
| Effect of Elevated Storage Temperature on the High Strain Rate Mechanical Properties of SAC305 Solder P Lall, V Mehta, J Suhling, K Blecker 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 10 | 2019 |
| Evaluation of the fracture parameters for SA-516 Grade 70 Material V Mehta Journal of Mechanical and Civil Engineering 13 (3), 38-45, 2016 | 9 | 2016 |
| High Strain Rate Properties of M758 Solder at Extreme Operating Temperatures P Lall, V Mehta, J Suhling, K Blecker 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 8 | 2021 |
| High strain rate properties of SAC305 alloy at cold temperatures subsequent to 100° C storage for periods up to 120 days P Lall, V Mehta, J Suhling, K Blecker 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 8 | 2021 |
| Effect of Evolution of High Strain Rate Properties on Plastic-Work of SAC305 Alloy with 100° C Aging for Periods up to 240-days P Lall, V Mehta, J Suhling, K Blecker 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 4 | 2022 |
| Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging P Lall, V Mehta, J Suhling, K Blecker International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 3 | 2021 |
| High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100° C Isothermal Aging for up to 180 Days P Lall, V Mehta, J Suhling, K Blecker 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure P Lall, V Mehta, V Yadav, M Saha, J Suhling, D Locker 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1646-1657, 2022 | 1 | 2022 |
| Artificial Intelligence-Based Methods for Assessment of Accrued Damage and Remaining Use-Life in Automotive Underhood Electronics P Lall, T Thomas, V Mehta 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific), 1-12, 2024 | | 2024 |
| Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration P Lall, V Mehta, J Suhling, D Locker International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100° C Sustained Operation Up to 1-Year P Lall, V Mehta, J Suhling, K Blecker International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-free Solders in Temperature Range of-65° C to+ 200° C after 1-Year Sustained High … P Lall, V Mehta, V Yadav, M Saha, J Suhling 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1072-1079, 2023 | | 2023 |
