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Co-authors
- Kun-You LinAssociate Professor of Graduate Institute of Communication Engineering, National Taiwan UniversityVerified email at ntu.edu.tw
- Ming-Da TsaiMediatekVerified email at mediatek.com
- Cheng (Ian) LiuAWS, Verizon, Huawei R&D USA, AT&T Labs, and Georgia TechVerified email at verizon.com
- Jianjun YuFudan UniversityVerified email at fudan.edu.cn
- Ming ZhuGeorgia Institute of Technology Verified email at gatech.edu
- Jing WangPrincipal Architect, CableLabsVerified email at cablelabs.com
- Debasis DawnUniversity of Washington, TacomaVerified email at uw.edu
- Med NarimanQualcomm Inc., IEEE Senior MemberVerified email at ieee.org
- stephane pinelMailChimpVerified email at mailchimp.com
- Padmanava SenResearch Group Leader, Barkhausen Institut, Dresden, GermanyVerified email at barkhauseninstitut.org
- Francesco BaraleDesign Engineering Manager, Radio Design Lead, Silicon Laboratories, Inc.Verified email at gatech.edu
- Gopal IyerAssistant Professor, University of Wisconsin-MadisonVerified email at wisc.edu
- Shu-Hao FanGeorgia institute of TechnologyVerified email at inphi.com
- Kevin ChuangAnalog DevicesVerified email at analog.com
- Ze DongBeijing Institute of Technology, ChinaVerified email at bit.edu.cn
- Anthony Ng'oma, PhDSr. Research Manager, Corning IncorporatedVerified email at ieee.org
- Chung Hang John PohGeorgia Institute of TechnologyVerified email at gatech.edu
- Gee-Kung ChangGeorgia Institute of Technology
- Yu-Ting HsuehJDS Uniphase Corp