| Impedimetric aptasensing using a symmetric Randles circuit model CY Lai, WC Huang, JH Weng, LC Chen, CF Chou, PK Wei Electrochimica Acta 337, 135750, 2020 | 10 | 2020 |
| Microfluidic amperometry with two symmetric Au microelectrodes under one-way and shuttle flow conditions JH Weng, CY Lai, LC Chen Electrochimica Acta 297, 118-128, 2019 | 8 | 2019 |
| Diffusion impedance modeling for interdigitated array electrodes by conformal mapping and cylindrical finite length approximation CY Lai, JH Weng, WL Shih, LC Chen, CF Chou, PK Wei Electrochimica Acta 320, 134629, 2019 | 7 | 2019 |
| Spectral contrast imaging method for mapping transmission surface plasmon images in metallic nanostructures MY Pan, DK Yang, CY Lai, JH Weng, KL Lee, LC Chen, CF Chou, PK Wei Biosensors and Bioelectronics 142, 111545, 2019 | 5 | 2019 |
| Nominality Score Conditioned Time Series Anomaly Detection by Point/Sequential Reconstruction CY Lai, FK Sun, Z Gao, JH Lang, DS Boning Thirty-seventh Conference on Neural Information Processing Systems, 2023 | 4 | 2023 |
| Semiconductor cell and active area arrangement P Wang, CY Lai, CY Lu, SH Chiu, HZ Zhuang, CL Chen US Patent US20230268339A1, 2023 | 1 | 2023 |
| Provable Routing Analysis of Programmable Photonics Z Gao, X Chen, Z Zhang, CY Lai, U Chakraborty, W Bogaerts, DS Boning arXiv preprint arXiv:2306.12607, 2023 | 1 | 2023 |
| Semiconductor device and method of making CY Lai, CL Chen, CY Lu, SH Chiu US Patent US20230008866A1, 2023 | 1 | 2023 |
| 對稱電極與指叉狀晶片電化學阻抗模型建立與適體感測應用 賴知佑 | 1 | 2019 |
| Provable Routing Analysis of Programmable Photonic Circuits Z Gao, X Chen, Z Zhang, CY Lai, U Chakraborty, W Bogaerts, DS Boning Journal of Lightwave Technology, 2024 | | 2024 |
| Learned Image Compression with Text Quality Enhancement CY Lai, D Tran, K Koishida arXiv preprint arXiv:2402.08643, 2024 | | 2024 |
| Source/drain isolation structure, layout, and method CY Lu, YH Chiu, CL Chen, CY Lai, SH Chiu US Patent US20230386998A1, 2023 | | 2023 |
| First metal structure, layout, and method CY Lu, CL Chen, CT Wu, CY Lai, SH Chiu US Patent US20230387011A1, 2023 | | 2023 |
| Semiconductor devices with reduced effect of capacitive coupling CY Lu, CY Lai, MH Wang, CL Chen, SH Chiu US Patent US20230386997A1, 2023 | | 2023 |
| Method of manufacturing integrated circuit CY Lai, HZ Zhuang, CL Chen, LC Tien US Patent US20230387014A1, 2023 | | 2023 |
| Semiconductor device including through via and method of making CY Lai, CL Chen, CY Lu, CH Wang US Patent US20230343703A1, 2023 | | 2023 |
| Arrangement of source or drain conductors of transistor CY Lai, CL Chen, CY Lu, SH Chiu US Patent US20230154990A1, 2023 | | 2023 |
| Semiconductor device segmented interconnect CY Lai, CL Chen, CW Tsai, SW Chang, LC Tien US Patent US20230067952A1, 2023 | | 2023 |
| Integrated circuits having stacked transistors and backside power nodes CY Lai, CL Chen, LC Tien US Patent US20230067311A1, 2023 | | 2023 |
| Integrated circuit conductive line arrangement for circuit structures, and method CY Lai, HZ Zhuang, CL Chen, LC Tien US Patent US20230062140A1, 2023 | | 2023 |
Lin-Chi ChenNational Taiwan UniversityVerified email at ntu.edu.tw
