| SMA microvalves for very large gas flow control manufactured using wafer-level eutectic bonding H Gradin, S Braun, G Stemme, W van der Wijngaart IEEE Transactions on Industrial Electronics 59 (12), 4895-4906, 2011 | 31 | 2011 |
| Wafer-scale manufacturing of bulk shape-memory-alloy microactuators based on adhesive bonding of titanium–nickel sheets to structured silicon wafers S Braun, N Sandstrom, G Stemme, W van der Wijngaart Journal of microelectromechanical systems 18 (6), 1309-1317, 2009 | 30 | 2009 |
| Micro 3D printing of a functional MEMS accelerometer S Pagliano, DE Marschner, D Maillard, N Ehrmann, G Stemme, S Braun, ... Microsystems & Nanoengineering 8 (1), 105, 2022 | 28 | 2022 |
| Row/column addressing scheme for large electrostatic actuator MEMS switch arrays and optimization of the operational reliability by statistical analysis S Braun, J Oberhammer, GÖ Stemme Journal of microelectromechanical systems 17 (5), 1104-1113, 2008 | 21 | 2008 |
| Method for the wafer-level integration of shape memory alloy wires S Braun, F Niklaus, A Fischer, H Gradin US Patent 9,054,224, 2015 | 17 | 2015 |
| Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology AC Fischer, H Gradin, S Braun, S Schröder, G Stemme, F Niklaus 2011 IEEE 24th international conference on micro electro mechanical systems …, 2011 | 17 | 2011 |
| Design and wafer-level fabrication of SMA wire microactuators on silicon D Clausi, H Gradin, S Braun, J Peirs, G Stemme, D Reynaerts, ... Journal of microelectromechanical systems 19 (4), 982-991, 2010 | 16 | 2010 |
| Robust actuation of silicon MEMS using SMA wires integrated at wafer-level by nickel electroplating D Clausi, H Gradin, S Braun, J Peirs, G Stemme, D Reynaerts, ... Sensors and Actuators A: Physical 189, 108-116, 2013 | 13 | 2013 |
| Wafer-level mechanical and electrical integration of SMA wires to silicon MEMS using electroplating D Clausi, H Gradin, S Braun, J Peirs, D Reynaerts, G Stemme, ... 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011 | 13 | 2011 |
| Out-of-plane knife-gate microvalves for controlling large gas flows S Haasl, S Braun, AS Ridgeway, S Sadoon, W Van Der Wijngaart, ... Journal of microelectromechanical systems 15 (5), 1281-1288, 2006 | 12 | 2006 |
| A low-power high-flow shape memory alloy wire gas microvalve H Gradin, D Clausi, S Braun, G Stemme, J Peirs, W van der Wijngaart, ... Journal of Micromechanics and Microengineering 22 (7), 075002, 2012 | 11 | 2012 |
| Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates AC Fischer, H Gradin, S Schröder, S Braun, G Stemme, ... Journal of Micromechanics and Microengineering 22 (5), 055025, 2012 | 10 | 2012 |
| Microactuation utilizing wafer-level integrated SMA wires D Clausi, H Gradin, S Braun, J Peirs, G Stemme, D Reynaerts, ... 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems …, 2009 | 10 | 2009 |
| Single-chip MEMS 5× 5 and 20× 20 double-pole single-throw switch arrays for automating telecommunication networks S Braun, J Oberhammer, G Stemme Journal of Micromechanics and Microengineering 18 (1), 015014, 2007 | 10 | 2007 |
| Localized removal of the Au–Si eutectic bonding layer for the selective release of microstructures H Gradin, S Braun, G Stemme, W Van der Wijngaart Journal of Micromechanics and Microengineering 19 (10), 105014, 2009 | 9 | 2009 |
| Smart individual switch addressing of 5× 5 and 20× 20 mems double-switch arrays S Braun, J Oberhammer, G Stemme TRANSDUCERS 2007-2007 International Solid-State Sensors, Actuators and …, 2007 | 7 | 2007 |
| MEMS single-chip5× 5 and 20× 20 double-switch arrays for telecommunication networks S Braun, J Oberhammer, G Stemme 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems …, 2007 | 7 | 2007 |
| Wafer-level heterogeneous integration of MEMS actuators S Braun KTH, 2010 | 6 | 2010 |
| Small footprint knife gate microvalves for large flow control S Braun, S Haasl, S Sadoon, AS Ridgeway, W van der Wijngaart, ... The 13th International Conference on Solid-State Sensors, Actuators and …, 2005 | 6 | 2005 |
| Wafer-level integration of NiTi shape memory alloy on silicon using Au–Si eutectic bonding H Gradin, S Bushra, S Braun, G Stemme, W Van der Wijngaart Journal of Micromechanics and Microengineering 23 (1), 015008, 2012 | 5 | 2012 |
