| Study of impact-induced mechanical effects in cell direct writing using smooth particle hydrodynamic method W Wang, Y Huang, M Grujicic, DB Chrisey Journal of Manufacturing Science and Engineering 130, 021012, 2008 | 106 | 2008 |
| Study of Impact-Induced Mechanical Effects in Cell Direct Writing Using Smooth Particle Hydrodynamic Method W Wang, Y Huang The 2nd International Conference on Micromanufacturing (ICOMM 2007), 257-262, 2007 | 106 | 2007 |
| Modeling of Bubble Expansion-Induced Cell Mechanical Profile in Laser-Assisted Cell Direct Writing W Wang, G Li, Y Huang ASME 2008 International Manufacturing Science and Engineering Conference …, 2008 | 72 | 2008 |
| Modeling of bubble expansion-induced cell mechanical profile in laser-assisted cell direct writing W Wang, G Li, Y Huang | 68 | 2009 |
| Parametric Study of Acoustic Excitation-Based Glycerol-Water Microsphere Fabrication in Single Nozzle Jetting CL Herran, W Wang, Y Huang, V Mironov, R Markwald Journal of Manufacturing Science and Engineering 132, 051001, 2010 | 25 | 2010 |
| Numerical study of cell droplet and hydrogel coating impact process in cell direct writing W Wang, Y Huang, DB Chrisey Trans. NAMRI/SME 35, 217-24, 2007 | 23 | 2007 |
| Simulation Model to Predict Failure Cycles in Board Level Drop Tests W Wang, D Robbins, C Glancey Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, 2016 | 13 | 2016 |
| Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages W Wang, D Zhang, Y Sun, D Rae, L Zhao, J Zheng, M Schwarz, M Shah, ... 2018 IEEE 68th Electronic Components and Technology Conference, 1039-1043, 2018 | 11 | 2018 |
| Modeling of Thermoelastic Stress Wave in Laser-Assisted Cell Direct Writing W Wang, Y Lin, Y Huang | 9 | 2011 |
| Methodology for the evaluation of double-layered microcapsule formability zone in compound nozzle jetting based on growth rate ratio W Wang, C Leigh Herran, N Coutris, Y Huang, V Mironov, R Markwald Journal of fluids engineering 135 (5), 051203, 2013 | 8 | 2013 |
| Warpage Variation Analysis and Model Prediction for Molded Packages AS Yuling Niu, Wei Wang, Zhijie Wang, Karthik Dhandapani, Mark Schwarz 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019 | 4 | 2019 |
| A Modeling Study of the Effect of Underfill Materials on Solder Joint Thermal Fatigue of Ball Grid Array Package W Wang, T Nguyen ASME 2014 International Mechanical Engineering Congress & Exposition 10 …, 2014 | 3 | 2014 |
| Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump Shear W Wang, W Zhao, M Nakamoto, M Schwarz, D He, X Zhang, L Zhao, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 229-235, 2020 | 2 | 2020 |
| Study of BEOL Failure Mode in Flip Chip Packages at High Temperature Conditions W Wang, Y Sun, X Zhang, L Wang, L Zhao, M Schwarz, B Stone, A Syed 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019 | 2 | 2019 |
| Integrated device comprising bump on exposed redistribution interconnect D He, L Zhao, W Wang, A Syed US Patent App. 15/843,865, 2018 | 2 | 2018 |
| Evaluation of Transverse Shear Effect on Film Delamination in Blister Test W Wang, Y Huang, N Coutris, H Noh, PJ Hesketh Journal of Electronic Packaging 132, 014501, 2010 | 1 | 2010 |
| Package comprising a substrate with post interconnects having a profile cross section of a trapezoid shape W Wang, K Kang, MY Kim, A Syed US Patent App. 17/939,769, 2024 | | 2024 |
| Aluminum Pad Plasticity-Related Bump Failure During Temperature Cycling W Wang, D He, D Rae 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1412-1417, 2021 | | 2021 |
| An Effective Method to Calculate Viscoelastic Parameters of Materials in Warpage Simulation W Wang Journal of Technical Leadership Program and Assembly, 2016 | | 2016 |
| Study of Double-Layered Microcapsule Formation in Compound Nozzle Jetting W Wang, CL Herran, N Coutris, Y Huang, V Mironov, R Markwald ASME 2010 International Manufacturing Science and Engineering Conference …, 2010 | | 2010 |
