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Co-authors
- Konrad RykaczewskiArizona State UniversityVerified email at asu.edu
- A MajumdarStanford UniversityVerified email at stanford.edu
- Wilson KongLawrence Livermore National LaboratoryVerified email at llnl.gov
- Rachel SegalmanEdward Noble Kramer Professor of Materials, UCSBVerified email at ucsb.edu
- Minglu LiuArizona State UniversityVerified email at asu.edu
- AASTHA UPPALPackaging R&D Engineer (Thermal/Mechanical)Verified email at intel.com
- Joseph P FeserUniversity of Delaware, Mechanical EngineeringVerified email at udel.edu
- Delia J. MillironThe University of Texas at AustinVerified email at che.utexas.edu
- Prathamesh B. VartakPackaging R&D engineer, Intel CorporationVerified email at asu.edu
- Kiran SolankiProfessor, Arizona State UniversityVerified email at asu.edu
- Dmitri TalapinProfessor of Chemistry, University of ChicagoVerified email at uchicago.edu
- Matthew D. GreenCenter Director, Center for Negative Carbon Emissions, Arizona State UniversityVerified email at asu.edu
- H.-S. Philip WongProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Jeff UrbanVerified email at lbl.gov
- Behnam (Seid) SadatSr. Data Scientist, Intuit AIVerified email at asu.edu
- Shaul AloniLawrence Berkeley National LabVerified email at lbl.gov
- X. Wendy GuAssistant Professor, Department of Mechanical Engineering, Stanford UniversityVerified email at stanford.edu
- Ravisubhash TangiralaNanosys Inc.Verified email at nanosysinc.com
- Jean Jordan-SweetIBM T.J. Watson Research CenterVerified email at us.ibm.com