| Microstructural optimization of a zeolite membrane for organic vapor separation Z Lai, G Bonilla, I Diaz, JG Nery, K Sujaoti, MA Amat, E Kokkoli, ... Science 300 (5618), 456-460, 2003 | 1280 | 2003 |
| Zeolite (MFI) crystal morphology control using organic structure-directing agents G Bonilla, I Díaz, M Tsapatsis, HK Jeong, Y Lee, DG Vlachos Chemistry of materials 16 (26), 5697-5705, 2004 | 206 | 2004 |
| Separation of close-boiling hydrocarbon mixtures by MFI and FAU membranes made by secondary growth S Nair, Z Lai, V Nikolakis, G Xomeritakis, G Bonilla, M Tsapatsis Microporous and Mesoporous Materials 48 (1-3), 219-228, 2001 | 169 | 2001 |
| Fluorescence confocal optical microscopy imaging of the grain boundary structure of zeolite MFI membranes made by secondary (seeded) growth G Bonilla, M Tsapatsis, DG Vlachos, G Xomeritakis Journal of Membrane Science 182 (1-2), 103-109, 2001 | 149 | 2001 |
| Simulations and experiments on the growth and microstructure of zeolite MFI films and membranes made by secondary growth G Bonilla, DG Vlachos, M Tsapatsis Microporous and mesoporous materials 42 (2-3), 191-203, 2001 | 93 | 2001 |
| Electromigration in cu (al) and cu (mn) damascene lines CK Hu, J Ohm, LM Gignac, CM Breslin, S Mittal, G Bonilla, D Edelstein, ... Journal of applied physics 111 (9), 2012 | 71 | 2012 |
| Zeolite membranes M Tsapatsis, G Xomeritakis, H Hillhouse, S Nair, V Nikolakis, G Bonilla CaTTech (Amsterdam) 3 (2), 148-163, 1999 | 67 | 1999 |
| Advanced multilayer dielectric cap with improved mechanical and electrical properties R Bhatia, G Bonilla, A Grill, JL Herman, S Van Nguyen, ET Ryan, ... US Patent 7,737,052, 2010 | 62 | 2010 |
| Ruthenium interconnect resistivity and reliability at 48 nm pitch X Zhang, H Huang, R Patlolla, W Wang, FW Mont, J Li, CK Hu, EG Liniger, ... 2016 IEEE international interconnect technology conference/advanced …, 2016 | 53 | 2016 |
| Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devices G Bonilla, CD Dimitrakopoulos, SV Nguyen, A Grill, SV Nitta, DD Restaino, ... US Patent 7,749,892, 2010 | 49 | 2010 |
| Reliability challenges for the 10nm node and beyond JH Stathis, M Wang, RG Southwick, EY Wu, BP Linder, EG Liniger, ... 2014 IEEE International Electron Devices Meeting, 20.6. 1-20.6. 4, 2014 | 43 | 2014 |
| Methods to mitigate plasma damage in organosilicate dielectrics JC Arnold, G Bonilla, WJ Cote, G Dubois, DC Edelstein, A Grill, E Huang, ... US Patent 8,481,423, 2013 | 41 | 2013 |
| Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node BD Briggs, CB Peethala, DL Rath, J Lee, S Nguyen, NV LiCausi, ... 2017 IEEE International Electron Devices Meeting (IEDM), 14.2. 1-14.2. 4, 2017 | 38 | 2017 |
| Critical ultra low-k TDDB reliability issues for advanced CMOS technologies F Chen, M Shinosky, B Li, J Gambino, S Mongeon, P Pokrinchak, J Aitken, ... 2009 IEEE International Reliability Physics Symposium, 464-475, 2009 | 38 | 2009 |
| BEOL process integration for the 7 nm technology node T Standaert, G Beique, HC Chen, ST Chen, B Hamieh, J Lee, ... 2016 IEEE international interconnect technology conference/advanced …, 2016 | 37 | 2016 |
| Interconnect structure for integrated circuits having enhanced electromigration resistance G Bonilla, K Chanda, RG Filippi, S Grunow, CK Hu, NE Lustig, AH Simon, ... US Patent 8,232,646, 2012 | 36 | 2012 |
| Selective thin metal cap process G Bonilla, ST Chen, ME Colburn, R Dellaguardia, CC Yang US Patent 7,514,361, 2009 | 36 | 2009 |
| Method for enabling hard mask free integration of ultra low-k materials and structures produced thereby G Bonilla, SM Gates, S Ponoth, SV Nitta, S Purushothaman US Patent App. 11/672,608, 2007 | 34 | 2007 |
| High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility T Nogami, T Bolom, A Simon, BY Kim, CK Hu, K Tsumura, A Madan, ... 2010 International Electron Devices Meeting, 33.5. 1-33.5. 4, 2010 | 32 | 2010 |
| A 45 nm CMOS node Cu/Low-k/Ultra Low-k PECVD SiCOH (k= 2.4) BEOL technology S Sankaran, S Arai, R Augur, M Beck, G Biery, T Bolom, G Bonilla, ... 2006 International Electron Devices Meeting, 1-4, 2006 | 31 | 2006 |
Naftali E. LustigIBM Systems and TechnologyVerified email at us.ibm.com
