Improving memory repair by selective row partitioning MT Rab, AA Bawa, NA Touba 2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI …, 2009 | 23 | 2009 |
Using partial masking in X-chains to increase output compaction for an X-canceling MISR AA Bawa, MT Rab, NA Touba Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), 2012 …, 2012 | 9 | 2012 |
Using asymmetric layer repair capability to reduce the cost of yield enhancement in 3D stacked memories MT Rab, AA Bawa, NA Touba 2012 IEEE/IFIP 20th International Conference on VLSI and System-on-Chip …, 2012 | 4 | 2012 |
Improving X-tolerant combinational output compaction via input rotation AA Bawa, NA Touba 2015 IEEE International Symposium on Defect and Fault Tolerance in VLSI and …, 2015 | 3 | 2015 |
Output compaction for high X-densities via improved input rotation compactor design AA Bawa, NA Touba 2017 IEEE AUTOTESTCON, 1-7, 2017 | 2 | 2017 |
Efficient compression of x-masking control data via dynamic channel allocation AA Bawa, MT Rab, NA Touba 2013 IEEE International Symposium on Defect and Fault Tolerance in VLSI and …, 2013 | 2 | 2013 |
Implementing defect tolerance in 3D-ICs by exploiting degrees of freedom in assembly MT Rab, A Bawa, NA Touba 2012 IEEE International Symposium on Defect and Fault Tolerance in VLSI and …, 2012 | 1 | 2012 |
Techniques to increase compaction of output responses with unknown (X) values AA Bawa | | 2018 |
Mode based skew to reduce scan instantaneous voltage drop and peak currents AA Bawa, BA Marrou, C Ng, MR Seningen, MS Sabnis, Z Mohammed, ... US Patent 9,488,692, 2016 | | 2016 |
Reducing Cost of Yield Enhancement in 3-D Stacked Memories Via Asymmetric Layer Repair Capability MT Rab, AA Bawa, NA Touba IEEE Transactions on Very Large Scale Integration (VLSI) Systems 22 (9 …, 2013 | | 2013 |