| Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder MII Ramli, N Saud, MAAM Salleh, MN Derman, RM Said Microelectronics Reliability 65, 255-264, 2016 | 58 | 2016 |
| The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7 Cu-0.05 Ni alloys for high strength soldering MII Ramli, MAAM Salleh, H Yasuda, J Chaiprapa, K Nogita Materials & Design 186, 108281, 2020 | 43 | 2020 |
| Relationship between free solder thickness to the solderability of Sn–0.7 Cu–0.05 Ni solder coating during soldering MII Ramli, MAA Mohd Salleh, FA Mohd Sobri, P Narayanan, K Sweatman, ... Journal of Materials Science: Materials in Electronics 30, 3669-3677, 2019 | 24 | 2019 |
| The influence of sintering temperature on the pore structure of an alkali-activated kaolin-based geopolymer ceramic MII Ramli, MAAM Salleh, MMAB Abdullah, IH Aziz, TC Ying, ... Materials 15 (7), 2667, 2022 | 22 | 2022 |
| Influence of Bi addition on wettability and mechanical properties of Sn-0.7 Cu solder alloy MII Ramli, MSS Yusof, MAA Mohd Salleh, RM Said, K Nogita Solid State Phenomena 273, 27-33, 2018 | 17 | 2018 |
| Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder NM Nasir, N Saud, MNB Derman, AAM Salleh, MII Ramli, RM Said Materials Science Forum 803, 273-277, 2015 | 13 | 2015 |
| Papillary carcinoma occurrence in a thyroglossal duct cyst with synchronous papillary thyroid carcinoma without cervical lymph node metastasis: two-cases report FB Sobri, M Ramli, UN Sari, M Umar, DK Mudrick Case Reports in Surgery 2015, 2015 | 12 | 2015 |
| Formation and growth of intermetallic compounds in lead-free solder joints: a review MII Ramli, MAAM Salleh, MMAB Abdullah, NSM Zaimi, AV Sandu, ... Materials 15 (4), 1451, 2022 | 10 | 2022 |
| Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties SFN Muhd Amli, MAA Mohd Salleh, MII Ramli, H Yasuda, J Chaiprapa, ... Journal of Electronic Materials 50, 710-722, 2021 | 10 | 2021 |
| Growth kinetic of Sn-0.7 Cu-0.05 Ni solder paste subjected to isothermal aging RM Said, MAA Mohd Salleh, MII Ramli, N Saud Solid State Phenomena 280, 163-168, 2018 | 10 | 2018 |
| Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste RM Said, MAA Mohd Salleh, MN Derman, MII Ramli, NM Nasir, N Saud Key Engineering Materials 700, 123-131, 2016 | 10 | 2016 |
| Effects of surface finish on Sn-3.0 Ag-0.5 Cu solder joint microstructure and strength SFN Muhd Amli, MAA Mohd Salleh, MII Ramli, NR Abdul Razak, ... Journal of Electronic Materials 50, 855-868, 2021 | 9 | 2021 |
| Performance of Sn-3.0 Ag-0.5 Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing NSM Zaimi, MAAM Salleh, AV Sandu, MMAB Abdullah, N Saud, ... Materials 14 (4), 776, 2021 | 9 | 2021 |
| Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste R Mohd Said, MAA Mohd Salleh, N Saud, MII Ramli, H Yasuda, K Nogita Journal of Materials Science: Materials in Electronics 31, 11077-11094, 2020 | 9 | 2020 |
| The effect of silicon nitride addition on microstructure and microhardness of SN100C solder alloy using powder metallurgy MII Ramli, N Saud, MAA Mohd Salleh, M Nazree Derman, R Mohd Said, ... Materials Science Forum 803, 228-232, 2015 | 9 | 2015 |
| Properties of Sn-3 wt% Ag-5 wt% Cu alloys with Cu6Sn5 intermetallics grain refined by Mg CY Tan, MAAM Salleh, XF Tan, H Yasuda, N Saud, MII Ramli, K Nogita Materials Today Communications 31, 103221, 2022 | 8 | 2022 |
| The effect of Ni and Bi additions on the solderability of Sn-0.7 Cu solder coatings MII Ramli, MAA Mohd Salleh, MMA Abdullah, P Narayanan, J Chaiprapa, ... Journal of Electronic Materials 49, 1-12, 2020 | 8 | 2020 |
| Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite Solder MII Ramli, MAA Mohd Salleh, MN Derman, RM Said, NM Nasir, N Saud Key Engineering Materials 700, 152-160, 2016 | 8 | 2016 |
| The effect of Ni on the growth morphology of primary β-phase in an In-35 wt% Sn alloy MS Chang, MAAM Salleh, DSC Halin, MII Ramli, H Yasuda, K Nogita Journal of Alloys and Compounds 897, 163172, 2022 | 7 | 2022 |
| Effect of electromigration and thermal ageing on the Tin whiskers’ formation in thin Sn–0.7 Cu–0.05 Ga lead (Pb)-free solder joints NZM Mokhtar, MAAM Salleh, AV Sandu, MM Ramli, J Chaiprapa, ... Coatings 11 (8), 935, 2021 | 7 | 2021 |
