| Mechanical alloying in the Fe-Cu system K Uenishi, KF Kobayashi, S Nasu, H Hatano, KN Ishihara, ... International Journal of Materials Research 83 (2), 132-135, 1992 | 230 | 1992 |
| Formation of a super-saturated solid solution in the Ag Cu system by mechanical alloying K Uenishi, KF Kobayashi, KN Ishihara, PH Shingu Materials Science and Engineering: A 134, 1342-1345, 1991 | 186 | 1991 |
| Formation of surface layer based on Al3Ti on aluminum by laser cladding and its compatibility with ceramics K Uenishi, KF Kobayashi Intermetallics 7 (5), 553-559, 1999 | 100 | 1999 |
| Effects of a third element on microstructure and mechanical properties of eutectic Sn–Bi solder S Sakuyama, T Akamatsu, K Uenishi, T Sato Transactions of The Japan Institute of Electronics Packaging 2 (1), 98-103, 2009 | 70 | 2009 |
| Electrostatic MEMS vibration energy harvesters inside of tire treads Y Naito, K Uenishi Sensors 19 (4), 890, 2019 | 63 | 2019 |
| Fabrication of a thick surface layer of Al3Ti on Ti substrate by reactive-pulsed electric current sintering T Matsubara, T Shibutani, K Uenishi, KF Kobayashi Intermetallics 8 (7), 815-822, 2000 | 63 | 2000 |
| Nano-structured intermetallic compound TiAl obtained by crystallization of mechanically alloyed amorphous TiAl, and its subsequent grain growth M Kambara, K Uenishi, KF Kobayashi Journal of materials science 35, 2897-2905, 2000 | 63 | 2000 |
| Nanostructured titanium-aluminides and their composites formed by combustion synthesis of mechanically alloyed powders K Uenishi, T Matsubara, M Kambara, KF Kobayashi Scripta materialia 44 (8-9), 2093-2097, 2001 | 52 | 2001 |
| Joining of the intermetallic compound TiAl using self-propagating high-temperature synthesis reaction K Uenishi, H Sumi, KF Kobayashi International Journal of Materials Research 86 (1), 64-68, 1995 | 50 | 1995 |
| Solid state powder processing PH Shingu, KN Ishihara, K Uenishi, J Kuyama, B Huang, S Nasu, ... by AH Clauer and JJ de Barbadillo, TMS 21, 1990 | 50 | 1990 |
| Processing of intermetallic compounds for structural applications at high temperature K Uenishi, KF Kobayashi Intermetallics 4, S95-S101, 1996 | 49 | 1996 |
| Tensile strength and pseudo-elasticity of YAG laser spot melted Ti-Ni shape memory alloy wires Y Ogata, M Takatugu, T Kunimasa, K Uenishi, KF Kobayashi Materials Transactions 45 (4), 1070-1076, 2004 | 45 | 2004 |
| Mechanical strength and microstructure of BGA joints using lead-free solders M Nishiura, A Nakayama, S Sakatani, Y Kohara, K Uenishi, KF Kobayashi Materials transactions 43 (8), 1802-1807, 2002 | 41 | 2002 |
| YAG laser microwelding of stainless steel and shape memory alloy K Uenishi, M Seki, T Kunimasa, M Takatsugu, KF Kobayashi, T Ikeda, ... Third International Symposium on Laser Precision Microfabrication 4830, 57-62, 2003 | 39 | 2003 |
| Enhanced densification of combustion synthesized Ni–Al intermetallic compound by Si addition T Kimata, K Uenishi, A Ikenaga, KF Kobayashi Intermetallics 11 (9), 947-952, 2003 | 37 | 2003 |
| Wear and oxidation resistance of Al2O3 particle dispersed Al3Ti composite with a nanostructure prepared by pulsed electric current sintering of mechanically alloyed powders K Uenishi, T Matsubara, T Shibutani, KF Kobayashi Intermetallics 10 (1), 105-111, 2002 | 34 | 2002 |
| Microstructure of mechanically alloyed Al-In alloys K Uenishi, H Kawaguchi, KF Kobayashi Journal of materials science 29, 4860-4865, 1994 | 34 | 1994 |
| Melting and joining behavior of Sn/Ag and Sn-Ag/Sn-Bi plating on Cu core ball K Uenishi, Y Kohara, S Sakatani, T Saeki, KF Kobayashi, M Yamamoto Materials Transactions 43 (8), 1833-1839, 2002 | 28 | 2002 |
| Joining of Intermetallice Compound TiAl by using Al Filler Metal K Uenishi, H Sumi, KF Kobayashi International Journal of Materials Research 86 (4), 270-274, 1995 | 28 | 1995 |
| Micro structure observation and reliability behavior of peripheral flip chip interconnections with solder-capped Cu pillar bumps Y Orii, K Toriyama, S Kohara, H Noma, K Okamoto, D Toyoshima, ... Transactions of The Japan Institute of Electronics Packaging 4 (1), 73-86, 2011 | 27 | 2011 |
