| Temperature dependence of elastic–plastic properties of fine-pitch SAC 0307 solder joint using nanoindentation approach A Jalar, MA Bakar, R Ismail Metallurgical and Materials Transactions A 51, 1221-1228, 2020 | 27 | 2020 |
| Correlation of microstructural evolution and hardness properties of 99.0 Sn-0.3 Ag-0.7 Cu (SAC0307) lead-free solder under blast wave condition WY Wan Yusoff, N Ismail, NS Safee, A Ismail, A Jalar, M Abu Bakar Soldering & Surface Mount Technology 31 (2), 102-108, 2019 | 21 | 2019 |
| A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints N Ismail, A Atiqah, A Jalar, MA Bakar, RAA Rahim, AG Ismail, AA Hamzah, ... Journal of Manufacturing Processes 83, 68-85, 2022 | 20 | 2022 |
| Nanoindentation approach on investigating micromechanical properties of joining from green solder materials MA Bakar, A Jalar, AR Daud, R Ismail, NCA Lah, NS Ibrahim Sains Malaysiana 45 (8), 1275-1279, 2016 | 20 | 2016 |
| Electrical resistivity of Sn–3.0 Ag–0.5 Cu solder joint with the incorporation of carbon nanotubes N Ismail, A Jalar, A Afdzaluddin, MA Bakar Nanomaterials and Nanotechnology 11, 1847980421996539, 2021 | 18 | 2021 |
| From the Front or Back Door? Quantitative analysis of direct and indirect extractions of α-mangostin from mangosteen (Garcinia mangostana) E Eukun Sage, N Jailani, AZ Md. Taib, N Mohd Noor, MI Mohd Said, ... Plos one 13 (10), e0205753, 2018 | 17 | 2018 |
| Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition N Ismail, A Jalar, M Abu Bakar, NS Safee, WY Wan Yusoff, A Ismail Soldering & Surface Mount Technology 33 (1), 47-56, 2021 | 16 | 2021 |
| Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu N Ismail, A Jalar, M Abu Bakar, R Ismail, N Saedi Ibrahim Soldering & Surface Mount Technology 32 (3), 157-164, 2020 | 15 | 2020 |
| Effect of isothermal aging on microhardness properties of Sn-Ag-Cu/CNT/Cu using nanoindentation N Ismail, A Jalar, M Abu Bakar, R Ismail, NS Safee, AG Ismail, NS Ibrahim Sains Malaysiana 48 (6), 1267-1272, 2019 | 12 | 2019 |
| Effect of carbon nanotube addition on the growth of intermetallic layer of Sn-Ag-Cu solder system under thermal aging N Ismail, A Jalar, MA Bakar, R Ismail Sains Malaysiana 47 (7), 1585-1590, 2018 | 11 | 2018 |
| Trust model based on Islamic business ethics and social network analysis NF Kolan, N Jailani, M Abu Bakar, R Latih International Journal of Advanced Science, Engineering and Information …, 2018 | 11 | 2018 |
| Metal chloride induced formation of porous Polyhydroxybutyrate (PHB) films: morphology, thermal properties and crystallinity WL Tan, NN Yaakob, AZ Abidin, MA Bakar, NHHA Bakar IOP Conference Series: Materials Science and Engineering 133 (1), 012012, 2016 | 11 | 2016 |
| The relationship between XRD peak intensity and mechanical properties of irradiated lead-free solder WS Paulus, IA Rahman, A Jalar, NK Othman, R Ismail, WY Wan Yusoff, ... Materials Science Forum 888, 423-427, 2017 | 10 | 2017 |
| Reflow optimization process: thermal stress using numerical analysis and intermetallic spallation in backwards compatibility solder joints FC Ani, A Jalar, R Ismail, NK Othman, MZ Abdullah, MSA Aziz, CY Khor, ... Arabian Journal for Science and Engineering 40, 1669-1679, 2015 | 10 | 2015 |
| Statistical aspect on the measuring of intermetallic compound thickness of lead free solders A Jalar, MA Bakar, R Ismail, AR Daud Journal of Scientific Research and Development 3 (4), 49-54, 2016 | 9 | 2016 |
| Effect of coating element on joining stability of Sn-0.3 Ag-0.7 Cu solder joint due to aging test AM Afdzaluddin, MA Bakar Sains Malaysiana 49 (12), 2983-2990, 2020 | 8* | 2020 |
| Effect of moisture content on crack formation during reflow soldering of ball grid array (BGA) component SMMSM Zain, FC Ani, MR Ramli, A Jalar, MA Bakar International Conference on Innovative Technology, Engineering and Science …, 2020 | 7 | 2020 |
| Reassessment of stereometric quantitative measurements on the growth of intermetallic compound for solder connections M Abu Bakar, A Jalar, R Ismail Sains Malaysiana 47 (4), 805-810, 2018 | 7 | 2018 |
| Nanoindentation of Sn3. 0Ag0. 5Cu/ENIG Solder Joint after High Temperature Storage M Abu Bakar, A Jalar, R Ismail, AR Daud Materials Science Forum 857, 40-43, 2016 | 7 | 2016 |
| Effects of PCB thickness on adjustable fountain wave soldering MSA Aziz, MZ Abdullah, CY Khor, A Jalar, MA Bakar, WYW Yusoff, FC Ani, ... Sadhana 40, 2197-2220, 2015 | 6 | 2015 |
Azman Jalarinstitute of microengineering and nanoelectronics (IMEN), universiti kebangsaan malaysiaVerified email at ukm.edu.my
