| Phase equilibria and solidification properties of Sn-Cu-Ni alloys CH Lin, SW Chen, CH Wang Journal of Electronic Materials 31, 907-915, 2002 | 187 | 2002 |
| Sn–0.7 wt.% Cu/Ni interfacial reactions at 250 C C Wang, S Chen Acta Materialia 54 (1), 247-253, 2006 | 147 | 2006 |
| Phase diagrams of Pb-free solders and their related materials systems KN Subramanian, SW Chen, CH Wang, SK Lin, CN Chiu Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 145 | 2007 |
| Sn/Co solid/solid interfacial reactions C Wang, S Chen Intermetallics 16 (4), 524-530, 2008 | 69 | 2008 |
| Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate C Wang, H Shen Intermetallics 18 (4), 616-622, 2010 | 58 | 2010 |
| Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing CH Wang, C Kuo, H Chen, S Chen Intermetallics 19 (1), 75-80, 2011 | 54 | 2011 |
| Temperature effects on liquid-state Sn/Co interfacial reactions C Wang, C Kuo, S Huang, P Li Intermetallics 32, 57-63, 2013 | 49 | 2013 |
| Interfacial reactions of Sn-Cu/Ni couples at 250 C S Chen, C Wang Journal of materials research 21, 2270-2277, 2006 | 49 | 2006 |
| Phase equilibria of Sn–Sb–Cu system S Chen, A Zi, W Gierlotka, C Yang, C Wang, S Lin, C Hsu Materials Chemistry and Physics 132 (2-3), 703-715, 2012 | 48 | 2012 |
| LA-ICPMS zircon U-Pb dating of Tangzang quartz-diorite pluton in the west segment of North Qinling Mountains and its tectonic significance C Jun-lu, XU Xue-yi, W Hong-liang, W Zong-qi, Z Zuo-xun Geoscience 22 (1), 45, 2008 | 44 | 2008 |
| Study of the effects of Zn content on the interfacial reactions between Sn-Zn solders and Ni substrates at 250° C C Wang, H Chen Journal of electronic materials 39, 2375-2381, 2010 | 42 | 2010 |
| Lowering of Sn− Sb alloy melting points caused by substrate dissolution SW Chen, PY Chen, CH Wang Journal of electronic materials 35, 1982-1985, 2006 | 42 | 2006 |
| Kinetic analysis of Ni5Zn21 growth at the interface between Sn–Zn solders and Ni C Wang, H Chen, P Li, P Chu Intermetallics 22, 166-175, 2012 | 41 | 2012 |
| Growth kinetics of the solid-state interfacial reactions in the Sn–Cu/Co and Sn/Co–Cu couples C Wang, C Kuo Materials Chemistry and Physics 130 (1-2), 651-656, 2011 | 40 | 2011 |
| Effects of electromigration on interfacial reactions in cast Sn/Cu joints SW Chen, CH Wang Journal of materials research 22, 695-702, 2007 | 40 | 2007 |
| Novel recombinant BCG coexpressing Ag85B, ESAT‐6 and mouse TNF‐α induces significantly enhanced cellular immune and antibody responses in C57BL/6 mice H Shen, C Wang, E Yang, Y Xu, W Liu, J Yan, F Wang, H Wang Microbiology and immunology 54 (8), 435-441, 2010 | 39 | 2010 |
| Interfacial reactions in the Sn-Bi/Te couples C Chiu, C Wang, S Chen Journal of electronic materials 37, 40-44, 2008 | 39 | 2008 |
| Solid-state interfacial reactions of Sn and Sn–Ag–Cu solders with an electroless Co (P) layer deposited on a Cu substrate C Wang, C Wen, C Lin Journal of Alloys and Compounds 662, 475-483, 2016 | 38 | 2016 |
| Interfacial reactions in the Sn–Sb/Ag and Sn–Sb/Cu couples S Chen, A Zi, P Chen, H Wu, Y Chen, C Wang Materials Chemistry and Physics 111 (1), 17-19, 2008 | 38 | 2008 |
| Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co (P) metallization on Cu substrate C Wang, S Huang, C Chiu Journal of Alloys and Compounds 619, 474-480, 2015 | 33 | 2015 |
