| A novel CAE method for compression molding simulation of carbon fiber-reinforced thermoplastic composite sheet materials Y Song, U Gandhi, T Sekito, UK Vaidya, J Hsu, A Yang, T Osswald Journal of Composites Science 2 (2), 33, 2018 | 14 | 2018 |
| Through fiber orientation investigation to visualize compression molding CC Hsu, HS Chiu, CT Huang, RY Chang AIP Conference Proceedings 1593 (1), 619-622, 2014 | 13 | 2014 |
| A study on warpage behavior of EMC in post-mold cure stage using Moldex3D H Chih-Chung, S Vallury, S Vallury, K Lin, A Yang Additional Papers and Presentations 2016 (DPC), 000826-000850, 2016 | 7 | 2016 |
| 3D simulation of fine pitch underfill encapsulation CC Hsu, HS Chiu, WH Yang, RY Chang 2010 5th International Microsystems Packaging Assembly and Circuits …, 2010 | 7 | 2010 |
| Simulation of dynamic gas penetrations on fingering behaviors during gas-assisted injection molding CC Hsu, CT Huang, RY Chang Journal of Polymer Engineering 38 (1), 93-105, 2018 | 6 | 2018 |
| Predict and solve stress mark on product’s cosmetic surface using controlled sequential valve gating simulation E Suhartono, HS Chiu, CC Hsu, CC Wang, CW Wang, N Pavan Proceedings of the Society of Plastics Engineers’ Annual Technical …, 2017 | 6 | 2017 |
| Computer-implemented simulation method and non-transitory computer medium for use in molding process TH Su, HS Chiu, RY Chang, CH Hsu, CC Chien, CC Hsu US Patent 9,409,335, 2016 | 6 | 2016 |
| 2.2 D Die last Integrated Substrate for High Performance Applications DC Hu, EH Chen, JCB Lee, CP Sun, CC Hsu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 157-163, 2021 | 5 | 2021 |
| Modeling of Molded Electronic Package Warpage Characteristic with Cure Induced Shrinkage and Viscoelasticity Properties WK Loh, RW Kulterman, CC Hsu, H Fu 2018 IEEE 38th International Electronics Manufacturing Technology Conference …, 2018 | 4 | 2018 |
| Void risk prediction for molded underfill technology on flip chip packages C Xu, J Liu, J Xu, P Sun, CC Hsu, CT Huang 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 4 | 2017 |
| Void risk prediction for semiconductor packages considering the air venting analysis with fluid/structure interaction method CC Hsu, CT Huang, RY Chang 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 185-189, 2016 | 4 | 2016 |
| 3D simulation of underfill encapsulation in semiconductor processing CC Hsu, HS Chiu, RY Chang 2012 7th International Microsystems, Packaging, Assembly and Circuits …, 2012 | 4 | 2012 |
| Investigation of fiber orientation in filling and packing phases CC Hsu, DD Hsieh, HS Chiu, M Yamabe Molding innovation, 2012 | 4 | 2012 |
| A Novel Equivalent Model for Underfill Molding Process On 2.2 D Structure for High Performance Applications YE Liang, CP Sun, CC Hsu, DC Hu, EH Chen, JC Lee 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 531-538, 2022 | 3 | 2022 |
| Impact of low temperature solder on electronic package dynamic warpage behavior and requirement WK Loh, RW Kulterman, H Fu, CC Hsu 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 318-324, 2019 | 3 | 2019 |
| Molded Electronic Package Warpage Predictive Modelling Methodologies KE Ong, WK Loh, RW Kulterman, CC Hsu, JA Wang, H Fu 2019 International Conference on Electronics Packaging (ICEP), 13-19, 2019 | 3 | 2019 |
| Investigation on the PVTC property characterization and its importance on IC encapsulation material application CC Wang, CT Huang, CC Hsu, RY Chang, R Huang, MF Huang, ... AIP Conference Proceedings 2065 (1), 2019 | 3 | 2019 |
| SiP module mold flowability experiment result and simulation study Y Jeong, B Ahn, J Hsu, A Yang, T Koyama, K Oi, J Lee, T Horie, M Tsuriya 2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018 | 3 | 2018 |
| SiP module warpage characterization and simulation study J Hsu, A Yang, Y Jeong, B Ahn, T Koyama, K Oi, J Lee, T Horie, M Tsuriya 2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018 | 3 | 2018 |
| Practical aspects for 3D simulation of underfill encapsulation CP Sun, CC Hsu, CT Huang, RY Chang 2016 11th International Microsystems, Packaging, Assembly and Circuits …, 2016 | 3 | 2016 |
