| Study of Self Heating Effect in the wake of complete and partial bottom dielectric insertion under 5 nm Stacked Nanosheet Transistor V Kumar, J Patel, A Datta, S Dasgupta Memories-Materials, Devices, Circuits and Systems 4, 100056, 2023 | 3 | 2023 |
| Machine Learning-based model for Single Event Upset Current Prediction in 14nm FinFETs V Vibhu, S Mittal, V Kumar 2023 36th International Conference on VLSI Design and 2023 22nd …, 2023 | 3 | 2023 |
| A Thermal Circuit Representing Frequency Dependent Dynamic Heating between Electron and Lattice in SOI-FinFET V Kumar, S Dasgupta, A Datta IEEE Transactions on Device and Materials Reliability 21 (4), 579-586, 2021 | 3 | 2021 |
| Ab-initio multiscale thermal modeling of 5 nm stacked nanosheet field effect transistor for thermal hotspot optimization inside the channel V Kumar, A Datta, S Dasgupta 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 1 | 2023 |
| Thermal Resistance Extraction of 14 nm SOI FinFET: A Machine Learning Based Approach P Bharti, H Muthusamy, V Kumar 2022 2nd International Conference on Emerging Frontiers in Electrical and …, 2022 | 1 | 2022 |
| Device Level Thermal Management in Multi-Fin SOI-FinFET Through Fin Pitch Design Employing Cooperative Game Theory V Kumar, S Dasgupta, A Datta IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | | 2023 |
| TCAD-Based Analysis of Nanosheet and Forksheet FET Electrical Characteristics in the Presence of Gamma and Heavy Ion Radiation N Anand, R Rai, Y Verma, AKS Chauhan, DK Sharma, V Kumar 2023 11th International Symposium on Electronic Systems Devices and …, 2023 | | 2023 |
| FEM modeling of gate resistance for 5 nm SGC/DGC Stacked Nanosheet Transistor V Kumar, J Patel, A Datta, S Dasgupta 2023 36th International Conference on VLSI Design and 2023 22nd …, 2023 | | 2023 |
| VLSI Design and Test: 26th International Symposium, VDAT 2022, Jammu, India, July 17–19, 2022, Revised Selected Papers AP Shah, S Dasgupta, A Darji, J Tudu Springer Nature, 2022 | | 2022 |
| FEM Modeling of Thermal Aspect of Dielectric Inserted Under Source & Drain of 5 nm Nanosheet V Kumar, J Patel, A Datta, S Dasgupta International Symposium on VLSI Design and Test, 3-11, 2022 | | 2022 |
Sudeb DasguptaDepartment of Electronics and Communication Engineering, IIT RoorkeeVerified email at iitr.ac.in
